Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8759119 | Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2014-06-24 |
| 8404496 | Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2013-03-26 |
| 7556985 | Method of fabricating semiconductor device | Norio Fukasawa, Hirohisa Matsuki, Yuzo Hamanaka, Muneharu Morioka | 2009-07-07 |
| 7112889 | Semiconductor device having an alignment mark formed by the same material with a metal post | Shigeyuki Maruyama, Yasuyuki Itoh, Tetsurou Honda, Kazuhiro Tashiro, Makoto Haseyama +2 more | 2006-09-26 |
| 7064047 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Hirohisa Matsuki, Yuzo Hamanaka, Muneharu Morioka | 2006-06-20 |
| 6987054 | Method of fabricating a semiconductor device having a groove formed in a resin layer | Norio Fukasawa, Hirohisa Matsuki, Yuzo Hamanaka, Muneharu Morioka | 2006-01-17 |
| 6784542 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Hirohisa Matsuki, Yuzo Hamanaka, Muneharu Morioka | 2004-08-31 |
| 6774650 | Probe card and method of testing wafer having a plurality of semiconductor devices | Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Eiji Yoshida +2 more | 2004-08-10 |
| 6657282 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Hirohisa Matsuki, Yuzo Hamanaka, Muneharu Morioka | 2003-12-02 |
| 6563330 | Probe card and method of testing wafer having a plurality of semiconductor devices | Shigeyuki Maruyama, Daisuke Koizumi, Naoyuki Watanabe, Yoshito Konno, Eiji Yoshida +2 more | 2003-05-13 |
| 6511620 | Method of producing semiconductor devices having easy separability from a metal mold after molding | Toshimi Kawahara, Hirohisa Matsuki, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa +2 more | 2003-01-28 |
| 6471501 | Mold for fabricating semiconductor devices | Yasuhiro Shinma, Muneharu Morioka, Norio Fukasawa, Yuzo Hamanaka, Tadashi Uno +1 more | 2002-10-29 |
| 6469370 | Semiconductor device and method of production of the semiconductor device | Toshimi Kawahara, Hirohisa Matsuki, Yasuhiro Shinma, Yoshiyuki Yoneda, Norio Fukasawa +2 more | 2002-10-22 |
| 6455920 | Semiconductor device having a ball grid array and a fabrication process thereof | Norio Fukasawa, Hirohisa Matsuki, Yuzo Hamanaka, Muneharu Morioka | 2002-09-24 |
| 6437432 | Semiconductor device having improved electrical characteristics and method of producing the same | Masamitsu Ikumo, Toshimi Kawahara, Norio Fukasawa | 2002-08-20 |
| 6218281 | Semiconductor device with flip chip bonding pads and manufacture thereof | Eiji Watanabe, Hirohisa Matsuki, Kenichi Kado, Masanori Onodera, Kunio Kodama +4 more | 2001-04-17 |