Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6232147 | Method for manufacturing semiconductor device with pad structure | Hirohisa Matsuki, Eiji Watanabe, Kazuyuki Imamura, Takahiro Yurino | 2001-05-15 |
| 6218281 | Semiconductor device with flip chip bonding pads and manufacture thereof | Eiji Watanabe, Hirohisa Matsuki, Kenichi Nagashige, Masanori Onodera, Kunio Kodama +4 more | 2001-04-17 |
| 5969424 | Semiconductor device with pad structure | Hirohisa Matsuki, Eiji Watanabe, Kazuyuki Imamura, Takahiro Yurino | 1999-10-19 |