Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6344407 | Method of manufacturing solder bumps and solder joints using formic acid | Hirohisa Matsuki, Fumihiko Taniguchi, Eiji Watanabe, Masataka Mizukoshi, Hiroyuki Matsui | 2002-02-05 |
| 6218281 | Semiconductor device with flip chip bonding pads and manufacture thereof | Eiji Watanabe, Hirohisa Matsuki, Kenichi Kado, Kenichi Nagashige, Masanori Onodera +4 more | 2001-04-17 |
| 5854558 | Test board for testing a semiconductor device and method of testing the semiconductor device | Toshiyuki Motooka, Syuichirou Takahashi, Tatsuharu Matsuda, Jouji Fujimori | 1998-12-29 |
| 5831441 | Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device | Toshiyuki Motooka, Syuichirou Takahasi, Tatsuharu Matsuda, Joji Fujimori, Shigeki Harada +3 more | 1998-11-03 |
| 4190555 | Catalyst system for polymerizing alpha-olefins and method of making same | Yoshinori Takamura, Hakusei Hamada, Kiyoyuki Kitamura, Tetsuro Inada, Katuyuki Usami | 1980-02-26 |