Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9425088 | Manufacturing method of semiconductor device | Takumi Ihara, Seiji Ueno, Yasunori Fujimoto | 2016-08-23 |
| 8564121 | Semiconductor device and manufacturing method of semiconductor device | Takumi Ihara, Seiji Ueno, Yasunori Fujimoto | 2013-10-22 |
| 7879713 | Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode | Seiki Sakuyama, Toshiya Akamatsu | 2011-02-01 |
| 7871917 | Semiconductor device and manufacturing method for the same | — | 2011-01-18 |
| 6897142 | Formation of solder balls having resin member as reinforcement | Ichiro Yamaguchi | 2005-05-24 |
| 6689639 | Method of making semiconductor device | Seiki Sakuyama, Masayuki Ochiai, Ichiro Yamaguchi | 2004-02-10 |
| 6218281 | Semiconductor device with flip chip bonding pads and manufacture thereof | Eiji Watanabe, Hirohisa Matsuki, Kenichi Kado, Kenichi Nagashige, Masanori Onodera +4 more | 2001-04-17 |
| 5831441 | Test board for testing a semiconductor device, method of testing the semiconductor device, contact device, test method using the contact device, and test jig for testing the semiconductor device | Toshiyuki Motooka, Syuichirou Takahasi, Tatsuharu Matsuda, Kunio Kodama, Shigeki Harada +3 more | 1998-11-03 |