Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10062658 | Electronic component and electronic device | Seiki Sakuyama, Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai | 2018-08-28 |
| 10056342 | Electronic component and electronic device | Seiki Sakuyama, Nobuhiro Imaizumi, Keisuke Uenishi, Kenichi Yasaka, Toru Sakai | 2018-08-21 |
| 9472527 | Semiconductor device and manufacturing method thereof | Muneyuki Odaira | 2016-10-18 |
| 9412715 | Semiconductor device, electronic device, and semiconductor device manufacturing method | Kozo Shimizu, Seiki Sakuyama | 2016-08-09 |
| 9235001 | Optical device and optical module | Shigeaki Sekiguchi, Nobuhiro Imaizumi, Shinji Tadaki, Akinori Hayakawa | 2016-01-12 |
| 8952271 | Circuit board, semiconductor device, and method of manufacturing semiconductor device | Masaharu Furuyama, Daisuke Mizutani, Seiki Sakuyama | 2015-02-10 |
| 8901751 | Semiconductor device, electronic device, and semiconductor device manufacturing method | Kozo Shimizu, Seiki Sakuyama | 2014-12-02 |
| 8740047 | Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same | Seiki Sakuyama, Masateru Koide | 2014-06-03 |
| 8692386 | Semiconductor device, method of manufacturing semiconductor device, and electronic device | — | 2014-04-08 |
| 8673762 | Solder, soldering method, and semiconductor device | Nobuhiro Imaizumi, Seiki Sakuyama, Keisuke Uenishi, Tetsuhiro Nakanishi | 2014-03-18 |
| 8556157 | Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same | Seiki Sakuyama, Masateru Koide | 2013-10-15 |
| 7879713 | Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode | Joji Fujimori, Seiki Sakuyama | 2011-02-01 |
| 7743966 | Soldering flux and method for bonding semiconductor element | Seiki Sakuyama | 2010-06-29 |
| 7604152 | Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same | Masayuki Ochiai, Hiroki Uchida | 2009-10-20 |
| 6796025 | Method for mounting electronic part and paste material | Kazuyuki Imamura, Osamu Yamaguchi, Yasunori Fujimoto | 2004-09-28 |
| 6764938 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Kazuaki Karasawa, Teru Nakanishi, Kozo Shimizu | 2004-07-20 |
| 6608381 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Kazuaki Karasawa, Teru Nakanishi, Kozo Shimizu | 2003-08-19 |
| 6136047 | Solder bump transfer plate | Kazuaki Karasawa, Teru Nakanishi | 2000-10-24 |
| 6008071 | Method of forming solder bumps onto an integrated circuit device | Kazuaki Karasawa, Teru Nakanishi | 1999-12-28 |
| 5977637 | Integrated electronic device having flip-chip connection with circuit board | Kazuaki Karasawa, Teru Nakanishi, Kozo Shimizu | 1999-11-02 |
| 5611481 | Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof | Kazuaki Karasawa, Teru Nakanishi, Kozo Shimizu | 1997-03-18 |