Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11317520 | Circuit board, method of manufacturing circuit board, and electronic device | Masaharu Furuyama, Daisuke Mizutani, Tomoyuki Akahoshi, Manabu Watanabe, Seigo Yamawaki +1 more | 2022-04-26 |
| 10396020 | Method of manufacturing board | Kei Fukui, Youichi Hoshikawa, Hiromitsu Kobayashi, Hidehiko Fujisaki, Seigo Yamawaki +3 more | 2019-08-27 |
| 10181437 | Package substrate and method of manufacturing package substrate | Manabu Watanabe, Kenji Fukuzono, Yuki Hoshino | 2019-01-15 |
| 9699887 | Circuit board and electronic device | Daisuke Mizutani, Kenichi Kawai, Takahito Takemoto | 2017-07-04 |
| 9515005 | Package mounting structure | Shunji Baba, Manabu Watanabe, Takashi Kanda, Kenji Fukuzono, Yuki Hoshino +1 more | 2016-12-06 |
| 8866270 | Method of manufacturing semiconductor device mounting structure | Manabu Watanabe, Kenji Fukuzono, Takashi Kanda | 2014-10-21 |
| 8811031 | Multichip module and method for manufacturing the same | Daisuke Mizutani | 2014-08-19 |
| 8740047 | Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same | Seiki Sakuyama, Toshiya Akamatsu | 2014-06-03 |
| 8716839 | Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus | Manabu Watanabe, Kenji Fukuzono, Takashi Kanda | 2014-05-06 |
| 8556157 | Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same | Seiki Sakuyama, Toshiya Akamatsu | 2013-10-15 |
| 8546187 | Electronic part and method of manufacturing the same | Daisuke Mizutani | 2013-10-01 |
| 8446020 | Multi-chip module | Daisuke Mizutani, Aiichiro Inoue, Hideo Yamashita, Iwao Yamazaki, Masayuki Kato +2 more | 2013-05-21 |
| 8368230 | Electronic part and method of manufacturing the same | — | 2013-02-05 |
| 8289728 | Interconnect board, printed circuit board unit, and method | — | 2012-10-16 |
| 7915541 | Multilayer interconnection substrate and manufacturing method therefor | Tomoyuki Abe | 2011-03-29 |
| 7301230 | Circuit board with a thin-film layer configured to accommodate a passive element | — | 2007-11-27 |
| 7291901 | Packaging method, packaging structure and package substrate for electronic parts | Misao Umematsu, Takashi Kanda, Yasuhiro Usui, Kenji Fukuzono | 2007-11-06 |
| 7268002 | Packaging method, packaging structure and package substrate for electronic parts | Misao Umematsu, Takashi Kanda, Yasuhiro Usui, Kenji Fukuzono | 2007-09-11 |
| 7057272 | Power supply connection structure to a semiconductor device | — | 2006-06-06 |
| 5670067 | Apparatus for laser cutting wiring in accordance with a measured size of the wiring | Hiroshi Ikeda | 1997-09-23 |
| 5550083 | Process of wirebond pad repair and reuse | Yasuo Kawamura | 1996-08-27 |
| 5455461 | Semiconductor device having reformed pad | Yasuo Kawamura | 1995-10-03 |