Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10586770 | Optical module | Takayoshi Matsumura, Naoaki Nakamura, Norio Kainuma, Takashi Kubota, Takumi Masuyama +2 more | 2020-03-10 |
| 10444450 | Optical module | Takayoshi Matsumura, Naoaki Nakamura, Norio Kainuma, Takashi Kubota, Takumi Masuyama +2 more | 2019-10-15 |
| 10418310 | BGA package substrate and method of manufacturing the same | Yuki Hoshino | 2019-09-17 |
| 10261249 | Optical module and method of manufacturing optical module | Norio Kainuma, Naoaki Nakamura | 2019-04-16 |
| 10181437 | Package substrate and method of manufacturing package substrate | Manabu Watanabe, Yuki Hoshino, Masateru Koide | 2019-01-15 |
| 9515005 | Package mounting structure | Shunji Baba, Masateru Koide, Manabu Watanabe, Takashi Kanda, Yuki Hoshino +1 more | 2016-12-06 |
| 9362202 | Electronic device and method for manufacturing same | Shunji Baba, Yuki Hoshino | 2016-06-07 |
| 9006876 | Semiconductor apparatus and manufacturing method thereof | Manabu Watanabe, Shunji Baba | 2015-04-14 |
| 8933558 | Semiconductor package, wiring board unit, and electronic apparatus | Manabu Watanabe | 2015-01-13 |
| 8866270 | Method of manufacturing semiconductor device mounting structure | Manabu Watanabe, Masateru Koide, Takashi Kanda | 2014-10-21 |
| 8716839 | Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus | Manabu Watanabe, Masateru Koide, Takashi Kanda | 2014-05-06 |
| 8642896 | Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit board | — | 2014-02-04 |
| 8168471 | Semiconductor device and manufacturing method of a semiconductor device | Takashi Kanda | 2012-05-01 |
| 8152953 | Method of making printed wiring board and method of making printed circuit board unit | Hideaki Yoshimura, Takashi Nakagawa, Takashi Kanda, Tomohisa Yagi | 2012-04-10 |
| 8119923 | Circuit board | Hideaki Yoshimura, Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Takashi Nakagawa +2 more | 2012-02-21 |
| 8089146 | Semiconductor device and heat radiation member | — | 2012-01-03 |
| 8023268 | Printed circuit board unit and semiconductor package | Hideaki Yoshimura | 2011-09-20 |
| 8004096 | Semiconductor device and a manufacturing method thereof | — | 2011-08-23 |
| 7943001 | Process for producing multilayer board | Takashi Nakagawa, Seiichi Sugano, Kenji Iida, Yasutomo Maehara, Hitoshi Suzuki +4 more | 2011-05-17 |
| 7787257 | Printed wiring board unit | — | 2010-08-31 |
| 7291901 | Packaging method, packaging structure and package substrate for electronic parts | Masateru Koide, Misao Umematsu, Takashi Kanda, Yasuhiro Usui | 2007-11-06 |
| 7268002 | Packaging method, packaging structure and package substrate for electronic parts | Masateru Koide, Misao Umematsu, Takashi Kanda, Yasuhiro Usui | 2007-09-11 |
| 7260806 | Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program | Hideaki Yoshimura | 2007-08-21 |
| 7222316 | Board design aiding apparatus, board design aiding method and board design aiding program | Hideaki Yoshimura | 2007-05-22 |
| 7053493 | Semiconductor device having stiffener | Takashi Kanda | 2006-05-30 |