Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9107314 | Method of manufacturing a wiring board having via structures | — | 2015-08-11 |
| 8878076 | Wiring substrate and manufacturing method for wiring substrate | — | 2014-11-04 |
| 8800142 | Package substrate unit and method for manufacturing package substrate unit | Hnin Nway San Nang, Kazuya Arai, Kei Fukui, Shinpei Ikegami, Yasuhito Takahashi +1 more | 2014-08-12 |
| 8754333 | Printed circuit board incorporating fibers | Kenji Iida, Yasutomo Maehara | 2014-06-17 |
| 8669481 | Laminated circuit board and board producing method | Asami HONDO | 2014-03-11 |
| 8586876 | Laminated circuit board and board producing method | — | 2013-11-19 |
| 8186053 | Circuit board and method of manufacturing the same | Kishio Yokouchi, Katsuya Fukase | 2012-05-29 |
| 8186052 | Method of producing substrate | Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Shin Hirano, Takashi Nakagawa +2 more | 2012-05-29 |
| 8161636 | Circuit board and method of manufacturing the same | Kishio Yokouchi, Katsuya Fukase | 2012-04-24 |
| 8151456 | Method of producing substrate | Yasutomo Maehara, Kenji Iida, Tomoyuki Abe, Shin Hirano, Takashi Nakagawa +2 more | 2012-04-10 |
| 8152953 | Method of making printed wiring board and method of making printed circuit board unit | Takashi Nakagawa, Kenji Fukuzono, Takashi Kanda, Tomohisa Yagi | 2012-04-10 |
| 8153908 | Circuit board and method of producing the same | Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Shin Hirano, Takashi Nakagawa +2 more | 2012-04-10 |
| 8119923 | Circuit board | Kenji Fukuzono, Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Takashi Nakagawa +2 more | 2012-02-21 |
| 8119925 | Core substrate and printed wiring board | Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Takashi Nakagawa, Shin Hirano | 2012-02-21 |
| 8110749 | Printed wiring board | Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Shin Hirano | 2012-02-07 |
| 8035037 | Core substrate and method of producing the same | Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Shin Hirano, Takashi Nakagawa +2 more | 2011-10-11 |
| 8023268 | Printed circuit board unit and semiconductor package | Kenji Fukuzono | 2011-09-20 |
| 7999193 | Wiring substrate and method of manufacturing the same | Katsuya Fukase, Kishio Yokouchi | 2011-08-16 |
| 7381592 | Method of making a semiconductor device with improved heat dissipation | — | 2008-06-03 |
| 7304389 | Semiconductor device and supporting plate | — | 2007-12-04 |
| 7260806 | Printed wiring board design aiding apparatus, printed wiring board design aiding method, and printed wiring board design aiding program | Kenji Fukuzono | 2007-08-21 |
| 7222316 | Board design aiding apparatus, board design aiding method and board design aiding program | Kenji Fukuzono | 2007-05-22 |
| 7199467 | Semiconductor device with improved heat dissipation, and a method of making semiconductor device | — | 2007-04-03 |
| 7115444 | Semiconductor device with improved heat dissipation, and a method of making semiconductor device | — | 2006-10-03 |
| 7101171 | Molding die for disc substrate | Osamu Matsuura, Kazuhiro Miura, Shinsuke Kishi | 2006-09-05 |