Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8754333 | Printed circuit board incorporating fibers | Hideaki Yoshimura, Kenji Iida | 2014-06-17 |
| 8186052 | Method of producing substrate | Kenji Iida, Tomoyuki Abe, Shin Hirano, Takashi Nakagawa, Hideaki Yoshimura +2 more | 2012-05-29 |
| 8153908 | Circuit board and method of producing the same | Kenji Iida, Tomoyuki Abe, Shin Hirano, Takashi Nakagawa, Hideaki Yoshimura +2 more | 2012-04-10 |
| 8151456 | Method of producing substrate | Kenji Iida, Tomoyuki Abe, Shin Hirano, Takashi Nakagawa, Hideaki Yoshimura +2 more | 2012-04-10 |
| 8119923 | Circuit board | Hideaki Yoshimura, Kenji Fukuzono, Kenji Iida, Tomoyuki Abe, Takashi Nakagawa +2 more | 2012-02-21 |
| 8119925 | Core substrate and printed wiring board | Hideaki Yoshimura, Kenji Iida, Tomoyuki Abe, Takashi Nakagawa, Shin Hirano | 2012-02-21 |
| 8110749 | Printed wiring board | Hideaki Yoshimura, Kenji Iida, Tomoyuki Abe, Shin Hirano | 2012-02-07 |
| 8035037 | Core substrate and method of producing the same | Kenji Iida, Tomoyuki Abe, Shin Hirano, Takashi Nakagawa, Hideaki Yoshimura +2 more | 2011-10-11 |
| 7943001 | Process for producing multilayer board | Takashi Nakagawa, Seiichi Sugano, Kenji Iida, Hitoshi Suzuki, Kaoru Sugimoto +4 more | 2011-05-17 |
| 6959125 | Printed board unit for optical transmission and mounting method | Takashi Kanda, Kiyotaka Seyama, Kaoru Sugimoto, Souichi Obata | 2005-10-25 |
| 6812412 | Multi-layer wiring board and method of producing same | Souichi Obata, Kazuhiko Iijima | 2004-11-02 |