KS

Kiyotaka Seyama

Fujitsu Limited: 14 patents #2,150 of 24,456Top 9%
Overall (All Time): #354,121 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
7935891 Wiring board manufacturing method Takashi Shuto, Kenji Takano, Kenji Iida, Kenichiro Abe, Keiji Arai 2011-05-03
7377030 Wiring board manufacturing method Takashi Shuto, Kenji Takano, Kenji IlDA, Kenichiro Abe, Keiji Arai 2008-05-27
6959125 Printed board unit for optical transmission and mounting method Takashi Kanda, Kaoru Sugimoto, Souichi Obata, Yasutomo Maehara 2005-10-25
6693362 Multichip module having chips mounted on upper and under surfaces of a thin film closing an opening formed in a rigid substrate Hiroshi Yamada, Haruhiko Yamamoto 2004-02-17
6057168 Method for forming bumps using dummy wafer Hideki Ota, Yasuhiro Usui, Kazuaki Satoh 2000-05-02
5894882 Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure Shunichi Kikuchi, Minoru Hirano, Hideaki Yoshimura, Takashi Kanda, Hitoshi Nori 1999-04-20
5862038 Cooling device for mounting module Masahiro Suzuki, Junichi Ishimine, Hisashi Kawashima, Keizo Takemura 1999-01-19
5608192 Multilayer thin-film wiring board Kiyokazu Moriizumi 1997-03-04
5586006 Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together Shunichi Kikuchi, Makoto Sumiyoshi, Naoki Yasuda, Minoru Hirano, Hitoshi Nori 1996-12-17
5432675 Multi-chip module having thermal contacts Haruo Sorimachi, Makoto Sumiyoshi, Kazuaki Satoh 1995-07-11
5181317 Method of making an engineering change to a printed wiring board Mikio Nishihara, Teruo Murase, Kiyoshi Kuwabara, Osamu Ohshima 1993-01-26
5166867 Bus bar for a circuit board Seiichi Saito, Chikayuki Kumagai, Toshinari Hayashi 1992-11-24
4949219 Module sealing structure Kiyokazu Moriizumi, Kyoichiro Kawano 1990-08-14
4912603 High density printed wiring board 1990-03-27