Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10516090 | Backing member | — | 2019-12-24 |
| 10153177 | Wiring substrate and semiconductor device | — | 2018-12-11 |
| 9087781 | Semiconductor device and method of manufacturing the same | Akinobu Inoue | 2015-07-21 |
| 8355262 | Electronic component built-in substrate and method of manufacturing electronic component built-in substrate | Akinobu Inoue | 2013-01-15 |
| 7342248 | Semiconductor device and interposer | — | 2008-03-11 |
| 6951811 | Method of producing vias and other conductor parts on an electrode terminal forming surface of a semiconductor wafer | — | 2005-10-04 |
| 6791186 | Mounting substrate and structure having semiconductor element mounted on substrate | Yoshihiro Yoneda | 2004-09-14 |
| 5592735 | Method of making a multi-chip module having an improved heat dissipation efficiency | Takashi Ozawa | 1997-01-14 |
| 5432675 | Multi-chip module having thermal contacts | Kiyotaka Seyama, Makoto Sumiyoshi, Kazuaki Satoh | 1995-07-11 |
| 4689638 | Thermal recording head and process for manufacturing wiring substrate therefor | Toshio Matsuzaki, Kiyoshi Satoh, Takumi Suzuki, Takeshi Sugii | 1987-08-25 |
| 4595823 | Thermal printing head with an anti-abrasion layer and method of fabricating the same | Kiyoshi Satoh, Takumi Suzuki | 1986-06-17 |
| 4446355 | Crossover construction of thermal-head and method of manufacturing same | Kiyoshi Sato, Minoru Terashima, Toshiaki Naka, Takeo Kanno, Fumiaki Yamada | 1984-05-01 |