Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5264730 | Resin mold package structure of integrated circuit | Hiroaki Toshima, Nobuo Hirasawa | 1993-11-23 |
| 4994895 | Hybrid integrated circuit package structure | Hiroaki Toshima | 1991-02-19 |
| 4689638 | Thermal recording head and process for manufacturing wiring substrate therefor | Haruo Sorimachi, Kiyoshi Satoh, Takumi Suzuki, Takeshi Sugii | 1987-08-25 |
| 4328312 | Process for production of peroxidase | Yoshihiro Tsurumi, Tomio Fujioka, Hidechika Wakabayashi | 1982-05-04 |