Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5586006 | Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together | Kiyotaka Seyama, Shunichi Kikuchi, Naoki Yasuda, Minoru Hirano, Hitoshi Nori | 1996-12-17 |
| 5432675 | Multi-chip module having thermal contacts | Haruo Sorimachi, Kiyotaka Seyama, Kazuaki Satoh | 1995-07-11 |
| 4794221 | Apparatus and method for exchanging electrode chips used for resistance welding | Fumio Takabe, Masashi Kitadate, Kiyohiko Igarashi, Kazuo Suzuki, Takashi Akita | 1988-12-27 |