Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8611087 | Cooling system for information device | Yoichi Sato, Kenji Tosaka, Mitsuo Hayashi, Akihiro Yasuo, Hideki Kimura +8 more | 2013-12-17 |
| 8004839 | Cooling system for information device | Yoichi Sato, Kenji Tosaka, Mitsuo Hayashi, Akihiro Yasuo, Hideki Kimura +8 more | 2011-08-23 |
| 7428154 | Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board | Junichi Ishimine, Tsuyoshi So | 2008-09-23 |
| 7055341 | High efficiency cooling system and heat absorbing unit | Jie Wei | 2006-06-06 |
| 5894882 | Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure | Shunichi Kikuchi, Minoru Hirano, Kiyotaka Seyama, Hideaki Yoshimura, Takashi Kanda | 1999-04-20 |
| 5763950 | Semiconductor element cooling apparatus | Akihiko Fujisaki, Junichi Ishimine, Masumi Suzuki, Masahiro Miyo, Shunichi Kikuchi +1 more | 1998-06-09 |
| 5586006 | Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together | Kiyotaka Seyama, Shunichi Kikuchi, Makoto Sumiyoshi, Naoki Yasuda, Minoru Hirano | 1996-12-17 |