| 11497120 |
Electronic card, method of manufacturing electronic card, and electronic apparatus |
— |
2022-11-08 |
| 11064631 |
Liquid immersion cooling device and information processing apparatus |
Hideo Kubo, Masayuki Watanabe, Shinnosuke Fujiwara |
2021-07-13 |
| 11032936 |
Information processing device and board device |
Takaya Nakayama, Jiro Tsujimura, Yuki Kanai, Yoichi Sato |
2021-06-08 |
| 10718554 |
Manifold and information processing apparatus |
Keita Hirai, Naofumi Kosugi |
2020-07-21 |
| 10701834 |
Information processing apparatus |
Osamu Aizawa, Nobumitsu Aoki, Koji Nakagawa, Keita Hirai |
2020-06-30 |
| 10607917 |
Substrate |
Takaya Nakayama, Takeshi Nishiyama, Jiro Tsujimura, Yuki Kanai |
2020-03-31 |
| 10342164 |
Rack mount-type information processing apparatus and rack mount-type information processing system |
Osamu Aizawa, Keita Hirai, Koji Nakagawa, Yoshinori Uzuka, Nobumitsu Aoki +1 more |
2019-07-02 |
| 10321609 |
Cooling system and method of cooling electronic device |
Keita Hirai, Naofumi Kosugi |
2019-06-11 |
| 10165706 |
Liquid immersion bath and liquid immersion cooling apparatus |
Keita Hirai, Naofumi Kosugi |
2018-12-25 |
| 9951999 |
Cooling device and electronic equipment |
Hideo Kubo, Osamu Aizawa, Nobuyuki Hayashi, Teru Nakanishi, Yoshinori Uzuka +1 more |
2018-04-24 |
| 9949402 |
Liquid loop cooling apparatus, electronic instrument, and method for manufacturing liquid loop cooling apparatus |
Hideo Kubo, Yoshinori Uzuka, Nobumitsu Aoki |
2018-04-17 |
| 9854710 |
Information processing device and container for data center |
Keita Hirai, Naofumi Kosugi |
2017-12-26 |
| 9778709 |
Evaporator, cooling device, and electronic apparatus |
Hideo Kubo |
2017-10-03 |
| 9694433 |
Method of joining cooling component |
Hideo Kubo, Yoshinori Uzuka, Nobumitsu Aoki |
2017-07-04 |
| 8709197 |
Method of making electronic component and heat conductive member and method of mounting heat conductive member for electronic component |
— |
2014-04-29 |
| 8421219 |
Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same |
Hideo Kubo, Seiji Ueno, Osamu Igawa |
2013-04-16 |
| 8309888 |
Electronic apparatus, power control device for controlling a heater, and method of controlling power control device |
Hideo Kubo |
2012-11-13 |
| 8264850 |
Electronic device package with connection terminals including uneven contact surfaces |
Hideki Maeda, Osamu Aizawa, Hideo Kubo |
2012-09-11 |
| 7999374 |
Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same |
Hideo Kubo, Seiji Ueno, Osamu Igawa |
2011-08-16 |
| 7872875 |
Mounting board, height adjusting apparatus and mounting method |
Yoshinori Uzuka, Osamu Aizawa, Hideo Kubo |
2011-01-18 |
| 7838987 |
Electronic device, standoff member, and method of manufacturing electronic device |
— |
2010-11-23 |
| 7834443 |
Semiconductor device with molten metal preventing member |
Hideo Kubo |
2010-11-16 |
| 7428154 |
Package structure, printed circuit board mounted with the same, electronic apparatus having the printed circuit board |
Junichi Ishimine, Hitoshi Nori |
2008-09-23 |
| 7144762 |
Semiconductor device with pins and method of assembling the semiconductor device |
— |
2006-12-05 |
