Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10443957 | Cooling plate and information processing device | Yoshihisa Iwakiri, Naoaki Nakamura, Takayoshi Matsumura | 2019-10-15 |
| 10108235 | Information processing apparatus and heat exchanger | Michimasa Aoki, Masumi Suzuki, Mitsutaka Yamada | 2018-10-23 |
| 9642287 | Cooling plate and data processing system provided with cooling plates | Yoshihisa Iwakiri, Naoaki Nakamura, Hiroshi Onuki | 2017-05-02 |
| 7951249 | RFID tag | Masumi Suzuki, Michimasa Aoki | 2011-05-31 |
| 7431218 | RFID tag, module component, and RFID tag fabrication method | Naoki Ishikawa, Shunji Baba, Hidehiko Kira, Hiroshi Kobayashi | 2008-10-07 |
| 7214563 | IC chip mounting method | Naoki Ishikawa, Shunji Baba, Hidehiko Kira, Hiroshi Kobayashi, Tatsuro Tsuneno | 2007-05-08 |
| 7199718 | RFID tag with thermal conductive cover | Masumi Suzuki, Michimasa Aoki | 2007-04-03 |
| 6891247 | Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding | Misao Umematsu | 2005-05-10 |
| 6787711 | Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device | Mitsutaka Yamada, Kenji Iketaki | 2004-09-07 |
| 6465085 | Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same | Zhiyi Song, Kiyokazu Moriizumi, Takami Sasahara, Norikazu Ozaki, Manabu Watanabe +1 more | 2002-10-15 |
| 6399897 | Multi-layer wiring substrate | Misao Umematsu, Kiyokazu Moriizumi, Kazuaki Satoh, Norikazu Ozaki | 2002-06-04 |
| 6303877 | Multilayer thin-film wiring board | Kiyokazu Moriizumi, Naomi Fukunaga | 2001-10-16 |
| 6300678 | I/O pin having solder dam for connecting substrates | Mitsuo Suehiro, Satoshi Osawa | 2001-10-09 |
| 6054652 | Thin-film multi-layer substrate and electronic device | Kiyokazu Moriizumi, Kazuhiro Nitta, Naomi Fukunaga, Mitsuo Suehiro | 2000-04-25 |
| 5894882 | Heat sink structure for cooling a substrate and an electronic apparatus having such a heat sink structure | Minoru Hirano, Kiyotaka Seyama, Hideaki Yoshimura, Takashi Kanda, Hitoshi Nori | 1999-04-20 |
| 5763950 | Semiconductor element cooling apparatus | Akihiko Fujisaki, Junichi Ishimine, Masumi Suzuki, Masahiro Miyo, Minoru Hirano +1 more | 1998-06-09 |
| 5586006 | Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together | Kiyotaka Seyama, Makoto Sumiyoshi, Naoki Yasuda, Minoru Hirano, Hitoshi Nori | 1996-12-17 |
| 5126919 | Cooling system for an electronic circuit device | Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama +1 more | 1992-06-30 |
| 5050037 | Liquid-cooling module system for electronic circuit components | Haruhiko Yamamoto, Kouji Katsuyama, Mitsuhiko Nakata | 1991-09-17 |
| 4920574 | Cooling system for an electronic circuit device | Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama +1 more | 1990-04-24 |
| 4879632 | Cooling system for an electronic circuit device | Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama +1 more | 1989-11-07 |
| 4783721 | Cooling system for an electronic circuit device | Haruhiko Yamamoto, Masahiro Suzuki, Yoshiaki Udagawa, Mitsuhiko Nakata, Koji Katsuyama +1 more | 1988-11-08 |
| 4712158 | Cooling system for electronic circuit components | Haruyuki Matsunaga, Hideo Katsumi, Koji Katsuyama | 1987-12-08 |