Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10614189 | Component retrieve device and component retrieve method | Yuji Maeda, Hajime Kubota, Masayuki Itoh | 2020-04-07 |
| 9541602 | Electronic component inspection apparatus and method | Hiroshi Kurosawa, Masayuki Itoh | 2017-01-10 |
| 9545044 | Electronic component assembly apparatus | Katsumi Takada, Masayuki Itoh | 2017-01-10 |
| 9307686 | Electronic component and electronic component assembly apparatus | Katsumi Takada, Masayuki Itoh | 2016-04-05 |
| 7579553 | Front-and-back electrically conductive substrate | — | 2009-08-25 |
| 7298605 | Electrolytic capacitor | Masayuki Itoh, Takao Ishikawa, Tomokazu Nakashima, Masako Okazaki | 2007-11-20 |
| 7222420 | Method for making a front and back conductive substrate | — | 2007-05-29 |
| 7005318 | Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times | Manabu Watanabe | 2006-02-28 |
| 6717262 | Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times | Manabu Watanabe | 2004-04-06 |
| 6618239 | Key switch and keyboard | Kouki Takahashi, Kouji Ishikawa, Kiyoshi Wada, Katsumi Harada, Junichi Maruyama +3 more | 2003-09-09 |
| 6526654 | Method of producing double-sided circuit board | Zhiyi Song, Kazuaki Satoh, Norikazu Ozaki | 2003-03-04 |
| 6485814 | High density thin film circuit board and method of production thereof | Mikio Nishihara | 2002-11-26 |
| 6465085 | Thin film wiring board and method for manufacturing the same, base substrate and method for manufacturing the same | Zhiyi Song, Takami Sasahara, Norikazu Ozaki, Manabu Watanabe, Misao Umematsu +1 more | 2002-10-15 |
| 6410983 | Semiconductor device having a plurality of multi-chip modules interconnected by a wiring board having an interface LSI chip | Satoshi Osawa | 2002-06-25 |
| 6399897 | Multi-layer wiring substrate | Misao Umematsu, Shunichi Kikuchi, Kazuaki Satoh, Norikazu Ozaki | 2002-06-04 |
| 6303877 | Multilayer thin-film wiring board | Shunichi Kikuchi, Naomi Fukunaga | 2001-10-16 |
| 6054652 | Thin-film multi-layer substrate and electronic device | Shunichi Kikuchi, Kazuhiro Nitta, Naomi Fukunaga, Mitsuo Suehiro | 2000-04-25 |
| 5608192 | Multilayer thin-film wiring board | Kiyotaka Seyama | 1997-03-04 |
| 5496971 | Circuit arrangement for multilayer printed circuit board | Mikio Nishihara | 1996-03-05 |
| 4949219 | Module sealing structure | Kyoichiro Kawano, Kiyotaka Seyama | 1990-08-14 |