Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485814 | High density thin film circuit board and method of production thereof | Kiyokazu Moriizumi | 2002-11-26 |
| 5496971 | Circuit arrangement for multilayer printed circuit board | Kiyokazu Moriizumi | 1996-03-05 |
| 5475922 | Method of assembling a connector using frangible contact parts | Akira Tamura, Hidehisa Sakai, Kyoichiro Kawano | 1995-12-19 |
| 5354209 | Connector and method of assembling the same | Akira Tamura, Hidehisa Sakai, Kyoichiro Kawano | 1994-10-11 |
| 5181317 | Method of making an engineering change to a printed wiring board | Teruo Murase, Kiyotaka Seyama, Kiyoshi Kuwabara, Osamu Ohshima | 1993-01-26 |
| 4785141 | Wiring structure of termination circuit | Kiyoshi Kuwabara | 1988-11-15 |
| 4692843 | Multilayer printed wiring board | Masaru Matsumoto, Kiyoshi Kuwabara | 1987-09-08 |
| 4675789 | High density multilayer printed circuit board | Kiyoshi Kuwabara, Kazuhisa Tsunoi | 1987-06-23 |
| 4298770 | Printed board | Masahiro Oda, Takamitsu Tsuchimoto | 1981-11-03 |