Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7759613 | Reflowing apparatus and reflowing method | — | 2010-07-20 |
| 6787711 | Printed wiring board device having heat-absorbing dummy parts, and method of manufacturing the printed wiring board device | Shunichi Kikuchi, Mitsutaka Yamada | 2004-09-07 |
| 6744183 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method | Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii +4 more | 2004-06-01 |
| 6541898 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method | Masayuki Kitajima, Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii +4 more | 2003-04-01 |
| 6467141 | Method of assembling micro-actuator | Toru Okada, Hidehiko Kobayashi, Yutaka Noda, Masayuki Kitajima, Seiichi Shimoura +4 more | 2002-10-22 |
| 5560534 | Soldering apparatus | Toru Okada, Naoki Yamasaki | 1996-10-01 |