Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11012048 | Filter and multiplexer | Toshimasa Numata, Hitoshi Ebihara, Naoto Kobayashi | 2021-05-18 |
| 10989743 | Power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating program | Tetsuji Ishikawa | 2021-04-27 |
| 9615464 | Method of mounting semiconductor element, and semiconductor device | Takashi Kubota, Takatoyo Yamakami, Hidehiko Kira | 2017-04-04 |
| 9195003 | Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the same | Takatoyo Yamakami, Takashi Kubota | 2015-11-24 |
| 9053262 | Method of determining reinforcement position of circuit substrate and substrate assembly | Hiroshi Kobayashi, Satoshi Emoto, Toru Okada, Takumi Masuyama | 2015-06-09 |
| 8604347 | Board reinforcing structure, board assembly, and electronic device | Hiroshi Kobayashi, Satoshi Emoto, Toru Okada | 2013-12-10 |
| 8418910 | Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device | Takatoyo Yamakami, Takashi Kubota, Kuniko Ishikawa | 2013-04-16 |
| 8314339 | Circuit board with kneaded conductive paste | Takeshi Ishitsuka, Satoshi Emoto | 2012-11-20 |
| 7911116 | Surface acoustic wave device and method of fabricating the same | Shunichi Aikawa, Keiji Tsuda | 2011-03-22 |
| 7841064 | Method of manufacturing an acoustic wave device | Shunichi Aikawa, Takumi Kooriike, Jyouji Kimura, Keiji Tsuda, Kazunori Inoue +1 more | 2010-11-30 |
| 7565739 | Method of making zinc-aluminum alloy connection | Ryoji Matsuyama | 2009-07-28 |
| 7425765 | Zinc-aluminum solder alloy | Tadaaki Shono, Ryoji Matsuyama | 2008-09-16 |
| 7356894 | Method of producing a micro-actuator | Masanao Fujii, Toru Okada, Hidehiko Kobayashi, Seiichi Shimoura | 2008-04-15 |
| 6893512 | Solder alloy and soldered bond | Tadaaki Shono, Masakazu Takesue, Yutaka Noda | 2005-05-17 |
| 6848154 | Method of producing a micro-actuator | Masanao Fujii, Toru Okada, Hidehiko Kobayashi, Seiichi Shimoura | 2005-02-01 |
| 6786385 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masakazu Takesue, Yoshitaka Muraoka | 2004-09-07 |
| 6744183 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method | Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki +4 more | 2004-06-01 |
| 6653761 | Micro-actuator and method of producing the same | Masanao Fujii, Toru Okada, Hidehiko Kobayashi, Seiichi Shimoura | 2003-11-25 |
| 6596094 | Solder paste and electronic device | Masayuki Ochiai, Yasuo Yamagishi, Hiroki Uchida, Masakazu Takesue, Tadaaki Shono | 2003-07-22 |
| 6541898 | Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method | Yutaka Noda, Seiichi Shimoura, Toru Okada, Masanao Fujii, Kenji Iketaki +4 more | 2003-04-01 |
| 6521176 | Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy | Masakazu Takesue, Yasuo Moriya, Yoshinori Nemoto, Yumiko Fukushima | 2003-02-18 |
| 6495441 | Semiconductor device with gold bumps, and method and apparatus of producing the same | Masakazu Takesue, Yoshitaka Muraoka | 2002-12-17 |
| 6467141 | Method of assembling micro-actuator | Toru Okada, Kenji Iketaki, Hidehiko Kobayashi, Yutaka Noda, Seiichi Shimoura +4 more | 2002-10-22 |
| 6432806 | Method of forming bumps and template used for forming bumps | Yutaka Noda, Yoshitaka Muraoka | 2002-08-13 |
| 6428911 | Soldering method and soldered joint | Masakazu Takesue, Tadaaki Shono, Motoko Fujioka | 2002-08-06 |