Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9615464 | Method of mounting semiconductor element, and semiconductor device | Takashi Kubota, Masayuki Kitajima, Hidehiko Kira | 2017-04-04 |
| 9266312 | Bonding apparatus and bonding method | Takashi Kubota, Hidehiko Kira | 2016-02-23 |
| 9195003 | Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the same | Takashi Kubota, Masayuki Kitajima | 2015-11-24 |
| 8861903 | Method of manufacturing optical waveguide device and optical waveguide device | Takashi Kubota, Kuniko Ishikawa, Hidehiko Kira | 2014-10-14 |
| 8720519 | Electronic packaging apparatus and electronic packaging method | Hidehiko Kira, Takashi Kubota, Kiyoshi Oi, Kiyoaki Iida, Takashi Kurihara | 2014-05-13 |
| 8418910 | Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device | Takashi Kubota, Kuniko Ishikawa, Masayuki Kitajima | 2013-04-16 |
| 7699235 | RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of manufacturing RFID tag | Shunji Baba, Naoki Ishikawa, Hiroshi Kobayashi, Masumi Katayama | 2010-04-20 |
| 7540428 | RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of manufacturing RFID tag | Shunji Baba, Naoki Ishikawa, Hiroshi Kobayashi, Masumi Katayama | 2009-06-02 |
| 7394163 | Method of mounting semiconductor chip | Shunji Baba, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi | 2008-07-01 |
| 7363704 | RFID tag and method of manufacturing RFID tag | Hiroshi Kobayashi, Naoki Ishikawa, Masumi Katayama, Syunji Baba | 2008-04-29 |
| 7347347 | Head assembly, disk unit, and bonding method and apparatus | Hidehiko Kira, Shunji Baba, Norio Kainuma, Toru Okada, Yasunori Sasaki +3 more | 2008-03-25 |
| 7196512 | Magnetic head tester | Norio Kainuma, Hidehiko Kira, Kenji Kobae, Hiroshi Kobayashi, Katsutoshi Hirasawa +2 more | 2007-03-27 |
| 7133733 | Design support system | Toru Okada, Masanao Fujii, Kazuhisa Mishima, Toshiaki Otsuka | 2006-11-07 |
| 6885522 | Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation | Hidehiko Kira, Shunji Baba, Norio Kainuma, Toru Okada, Yasunori Sasaki +3 more | 2005-04-26 |
| 6770319 | Resin coating method | Shunji Baba, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi | 2004-08-03 |
| 6716665 | Method of mounting chip onto printed circuit board in shortened working time | Shunji Baba, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi | 2004-04-06 |
| 6437450 | Method of mounting semiconductor chip | Shunji Baba, Norio Kainuma, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi | 2002-08-20 |