Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12185470 | Embedded printed circuit board | Yukinori Hatori, Takashi Kurihara | 2024-12-31 |
| 11817381 | Semiconductor device | Kei Murayama, Mitsuhiro Aizawa, Amane KANEKO | 2023-11-14 |
| 11706877 | Composite wiring substrate and semiconductor device | Shota Miki, Koyuki Kawakami, Kei Murayama, Mitsuhiro Aizawa | 2023-07-18 |
| 9997450 | Wiring substrate and semiconductor device | Tomotake Minemura | 2018-06-12 |
| 9859201 | Wiring substrate, semiconductor device, and method for manufacturing wiring substrate | Noriyoshi Shimizu, Yuichiro Shimizu | 2018-01-02 |
| 9622347 | Wiring substrate, semiconductor device, method of manufacturing wiring substrate, and method of manufacturing semiconductor device | Takashi Kurihara | 2017-04-11 |
| 9530744 | Semiconductor device and method of manufacturing the same | Satoshi Otake | 2016-12-27 |
| 9307641 | Wiring substrate and semiconductor device | Takashi Kurihara | 2016-04-05 |
| 9048331 | Method of manufacturing semiconductor device | Yoshihiro Machida, Hiroyuki Saito, Yohei Igarashi | 2015-06-02 |
| 8720519 | Electronic packaging apparatus and electronic packaging method | Takatoyo Yamakami, Hidehiko Kira, Takashi Kubota, Kiyoaki Iida, Takashi Kurihara | 2014-05-13 |
| 8669653 | Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor | — | 2014-03-11 |
| 8334461 | Wiring board and electronic component device | Yuichi Taguchi, Teruaki Chino | 2012-12-18 |
| 8138018 | Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board | Takashi Kurihara | 2012-03-20 |
| 8111954 | Module substrate including optical transmission mechanism and method of producing the same | Naoyuki Koizumi, Akihiko Tateiwa | 2012-02-07 |
| 8017503 | Manufacturing method of semiconductor package | Toru Hizume, Fumimasa Katagiri, Akihiko Tateiwa | 2011-09-13 |
| 7963031 | Package for semiconductor device and method of manufacturing the same | Naoyuki Koizumi, Akihiko Tateiwa | 2011-06-21 |
| 7928557 | Stacked package and method for manufacturing the package | Teruaki Chino | 2011-04-19 |
| 7859121 | Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same | Masahiro Sunohara | 2010-12-28 |
| 7768140 | Semiconductor device | — | 2010-08-03 |
| 7678612 | Method of manufacturing semiconductor device | Tomoharu Fujii | 2010-03-16 |
| 7678681 | Electronic component built-in substrate and method of manufacturing the same | — | 2010-03-16 |
| 7536780 | Method of manufacturing wiring substrate to which semiconductor chip is mounted | Noriyoshi Shimizu, Tomoo Yamasaki, Akio Rokugawa | 2009-05-26 |
| 7414309 | Encapsulated electronic part packaging structure | Noriyoshi Shimizu, Yasuyoshi Horikawa | 2008-08-19 |
| 7403370 | Capacitor parts | Noriyoshi Shimizu, Tomoo Yamasaki | 2008-07-22 |
| 7375022 | Method of manufacturing wiring board | Noriyoshi Shimizu, Tomoo Yamasaki | 2008-05-20 |