Issued Patents All Time
Showing 1–25 of 117 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400897 | Substrate fixing device | Riku Nishikawa | 2025-08-26 |
| 12238473 | Apparatus and method for performing active occlusion cancellation with audio hear-through | Wenyu Jin, Jingjing Xu | 2025-02-25 |
| 12205841 | Electrostatic chuck and substrate fixing device | Ken Sato, Tatsuya Nakamura | 2025-01-21 |
| 10863272 | System identification device, system identification method, system identification program, and recording medium recording system identification program | Kiyoshi Nishiyama, Nobuhiko Hiruma, Chiho Haruta, Makoto Tateno | 2020-12-08 |
| 10582315 | Feedback canceller and hearing aid | Nobuhiko Hiruma | 2020-03-03 |
| 10482894 | Dereverberation device and hearing aid | Masatoshi Osawa, Yoichi Fujisaka, Yoko Fujishima | 2019-11-19 |
| 10410640 | Sound source separation apparatus | Nobutaka Ono, Chiho Haruta | 2019-09-10 |
| 9530429 | Reverberation suppression apparatus used for auditory device | Mariko Nakaichi | 2016-12-27 |
| 9392705 | Wiring board with through wiring | Yuichiro Shimizu | 2016-07-12 |
| 9392380 | Hearing aid and feedback canceller | — | 2016-07-12 |
| 9357315 | Hearing aid, loudspeaker, and feedback canceller | Kazuteru Nishiyama | 2016-05-31 |
| 9318351 | Wiring substrate | — | 2016-04-19 |
| 8895868 | Wiring substrate | — | 2014-11-25 |
| 8810007 | Wiring board, semiconductor device, and method for manufacturing wiring board | Akihito Takano, Hideaki Sakaguchi, Mitsutoshi Higashi, Kenichi Ota, Yuichi Sasajima | 2014-08-19 |
| 8669643 | Wiring board, semiconductor device, and method for manufacturing wiring board | Akihito Takano, Hideaki Sakaguchi, Mitsutoshi Higashi, Kenichi Ota, Yuichi Sasajima | 2014-03-11 |
| 8664536 | Wiring substrate and manufacturing method thereof | Shigeaki Suganuma | 2014-03-04 |
| 8564077 | Package for electronic component, manufacturing method thereof and sensing apparatus | Akinori Shiraishi, Hideaki Sakaguchi, Yuichi Taguchi, Mitsutoshi Higashi | 2013-10-22 |
| 8481863 | Substrate and method for manufacturing the same | Akinori Shiraishi, Kei Murayama, Naoyuki Koizumi, Mitsutoshi Higashi | 2013-07-09 |
| 8446013 | Wiring substrate and method for manufacturing the wiring substrate | Takayuki Tokunaga, Hedeaki Sakaguchi, Akihito Takano | 2013-05-21 |
| 8405953 | Capacitor-embedded substrate and method of manufacturing the same | Tomoharu Fujii | 2013-03-26 |
| 8379400 | Interposer mounted wiring board and electronic component device | — | 2013-02-19 |
| 8368206 | Heat radiation package and semiconductor device | Akinori Shiraishi, Kei Murayama, Yuichi Taguchi, Mitsutoshi Higashi | 2013-02-05 |
| 8350390 | Wiring substrate and semiconductor device | Kei Murayama, Akinori Shiraishi, Hideaki Sakaguchi | 2013-01-08 |
| 8309860 | Electronic component built-in substrate and method of manufacturing the same | Hideaki Sakaguchi, Hiroshi Shimizu | 2012-11-13 |
| 8304862 | Semiconductor package and manufacturing method of the same | Yuichi Taguchi, Mitsutoshi Higashi, Akinori Shiraishi, Hideaki Sakaguchi | 2012-11-06 |