Issued Patents All Time
Showing 1–25 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9591742 | Interposer and semiconductor device including the same | Kei Murayama, Koji Nagai, Hideaki Sakaguchi | 2017-03-07 |
| 9099615 | Light emitting device that includes wavelength conversion layer having outer peripheral portion having convex projecting part with light reflection layer formed thereon | Yasuaki Tsutsumi, Masanobu Mizuno, Yasutaka Sasaki, Akinori Shiraishi, Rie Arai | 2015-08-04 |
| 9052341 | Probe card and manufacturing method thereof | Akinori Shiraishi, Hideaki Sakaguchi | 2015-06-09 |
| 8922234 | Probe card and method for manufacturing probe card | Akinori Shiraishi, Hideaki Sakaguchi | 2014-12-30 |
| 8922232 | Test-use individual substrate, probe, and semiconductor wafer testing apparatus | Shigeru Matsumura, Kohei Kato, Katsushi Sugai, Koichi Shiroyama, Akinori Shiraishi +1 more | 2014-12-30 |
| 8878357 | Electronic component device, method of manufacturing the same and wiring substrate | Yuichi Taguchi, Akinori Shiraishi | 2014-11-04 |
| 8810007 | Wiring board, semiconductor device, and method for manufacturing wiring board | Akihito Takano, Masahiro Sunohara, Hideaki Sakaguchi, Kenichi Ota, Yuichi Sasajima | 2014-08-19 |
| 8777638 | Wiring board and method of manufacturing the same | Hideaki Sakaguchi, Akinori Shiraishi | 2014-07-15 |
| 8671561 | Substrate manufacturing method | Kiyoaki Iida, Kazuo Tanaka, Hideaki Sakaguchi | 2014-03-18 |
| 8669643 | Wiring board, semiconductor device, and method for manufacturing wiring board | Akihito Takano, Masahiro Sunohara, Hideaki Sakaguchi, Kenichi Ota, Yuichi Sasajima | 2014-03-11 |
| 8611389 | Light emitting device and package component | Akinori Shiraishi | 2013-12-17 |
| 8564077 | Package for electronic component, manufacturing method thereof and sensing apparatus | Akinori Shiraishi, Masahiro Sunohara, Hideaki Sakaguchi, Yuichi Taguchi | 2013-10-22 |
| 8481863 | Substrate and method for manufacturing the same | Akinori Shiraishi, Kei Murayama, Masahiro Sunohara, Naoyuki Koizumi | 2013-07-09 |
| 8368206 | Heat radiation package and semiconductor device | Akinori Shiraishi, Kei Murayama, Yuichi Taguchi, Masahiro Sunohara | 2013-02-05 |
| 8338289 | Method of manufacturing a semiconductor chip including a semiconductor substrate and a through via provided in a through hole | Kei Murayama | 2012-12-25 |
| 8304862 | Semiconductor package and manufacturing method of the same | Yuichi Taguchi, Akinori Shiraishi, Hideaki Sakaguchi, Masahiro Sunohara | 2012-11-06 |
| 8299370 | Wiring board and method of manufacturing the same | Hideaki Sakaguchi, Akinori Shiraishi | 2012-10-30 |
| 8227909 | Semiconductor package and method of manufacturing the same | Hideaki Sakaguchi, Yuichi Taguchi, Akinori Shiraishi, Kei Murayama | 2012-07-24 |
| 8216884 | Production methods of electronic devices | — | 2012-07-10 |
| 8183679 | Electronic part package | Hideaki Sakaguchi, Masahiro Sunohara | 2012-05-22 |
| 8178957 | Electronic component device, and method of manufacturing the same | Yuichi Taguchi, Akinori Shiraishi, Kei Murayama | 2012-05-15 |
| 8169073 | Semiconductor device and electronic apparatus of multi-chip packaging | Kei Murayama | 2012-05-01 |
| 8148738 | Semiconductor device having an element mounted on a substrate and an electrical component connected to the element | Kei Murayama, Naoyuki Koizumi, Yuichi Taguchi, Akinori Shiraishi, Masahiro Sunohara | 2012-04-03 |
| 8137497 | Method of manufacturing wiring substrate | Masahiro Sunohara, Kei Murayama, Hideaki Sakaguchi | 2012-03-20 |
| 8108993 | Method of manufacturing wiring substrate, and method of manufacturing semiconductor device | Kei Murayama, Masahiro Sunohara, Hideaki Sakaguchi | 2012-02-07 |