Issued Patents All Time
Showing 1–25 of 66 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9523716 | Probe guide plate and method for manufacturing the same | Kosuke Fujihara | 2016-12-20 |
| 9459287 | Guide plate for probe card | Teppei Kimura, Kosuke Fujihara | 2016-10-04 |
| 9099615 | Light emitting device that includes wavelength conversion layer having outer peripheral portion having convex projecting part with light reflection layer formed thereon | Yasuaki Tsutsumi, Masanobu Mizuno, Yasutaka Sasaki, Mitsutoshi Higashi, Rie Arai | 2015-08-04 |
| 9052341 | Probe card and manufacturing method thereof | Hideaki Sakaguchi, Mitsutoshi Higashi | 2015-06-09 |
| 8922234 | Probe card and method for manufacturing probe card | Hideaki Sakaguchi, Mitsutoshi Higashi | 2014-12-30 |
| 8922232 | Test-use individual substrate, probe, and semiconductor wafer testing apparatus | Shigeru Matsumura, Kohei Kato, Katsushi Sugai, Koichi Shiroyama, Mitsutoshi Higashi +1 more | 2014-12-30 |
| 8878357 | Electronic component device, method of manufacturing the same and wiring substrate | Yuichi Taguchi, Mitsutoshi Higashi | 2014-11-04 |
| 8836119 | Semiconductor device | Kei Murayama, Kenichi Mori | 2014-09-16 |
| 8777638 | Wiring board and method of manufacturing the same | Hideaki Sakaguchi, Mitsutoshi Higashi | 2014-07-15 |
| 8772822 | Light emitting device | Rie Arai | 2014-07-08 |
| 8759685 | Wiring substrate and method of manufacturing the wiring substrate | Hideaki Sakaguchi | 2014-06-24 |
| 8622556 | Frame-attached anti-reflection glass and method of manufacturing the same | Kei Murayama | 2014-01-07 |
| 8611389 | Light emitting device and package component | Mitsutoshi Higashi | 2013-12-17 |
| 8564077 | Package for electronic component, manufacturing method thereof and sensing apparatus | Masahiro Sunohara, Hideaki Sakaguchi, Yuichi Taguchi, Mitsutoshi Higashi | 2013-10-22 |
| 8532457 | Method of manufacturing optical waveguide, optical waveguide and optical transmission device | Yuichi Taguchi | 2013-09-10 |
| 8481863 | Substrate and method for manufacturing the same | Kei Murayama, Masahiro Sunohara, Naoyuki Koizumi, Mitsutoshi Higashi | 2013-07-09 |
| 8394678 | Semiconductor chip stacked body and method of manufacturing the same | Kei Murayama, Mitsuhiro Aizawa | 2013-03-12 |
| 8372691 | Method of manufacturing semiconductor device | — | 2013-02-12 |
| 8368206 | Heat radiation package and semiconductor device | Kei Murayama, Yuichi Taguchi, Masahiro Sunohara, Mitsutoshi Higashi | 2013-02-05 |
| 8350390 | Wiring substrate and semiconductor device | Kei Murayama, Masahiro Sunohara, Hideaki Sakaguchi | 2013-01-08 |
| 8314344 | Wiring board and manufacturing method of the same | Hideaki Sakaguchi | 2012-11-20 |
| 8304862 | Semiconductor package and manufacturing method of the same | Yuichi Taguchi, Mitsutoshi Higashi, Hideaki Sakaguchi, Masahiro Sunohara | 2012-11-06 |
| 8299370 | Wiring board and method of manufacturing the same | Hideaki Sakaguchi, Mitsutoshi Higashi | 2012-10-30 |
| 8227909 | Semiconductor package and method of manufacturing the same | Hideaki Sakaguchi, Mitsutoshi Higashi, Yuichi Taguchi, Kei Murayama | 2012-07-24 |
| 8178957 | Electronic component device, and method of manufacturing the same | Yuichi Taguchi, Mitsutoshi Higashi, Kei Murayama | 2012-05-15 |