Issued Patents All Time
Showing 1–25 of 87 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10588533 | Bioelectrode component | Yoshihiro Ihara | 2020-03-17 |
| 10206283 | Electronic device | — | 2019-02-12 |
| 10134680 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hajime Iizuka, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2018-11-20 |
| 9768122 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hajime Iizuka, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2017-09-19 |
| 9646924 | Interposer, method for manufacturing interposer, and semiconductor device | — | 2017-05-09 |
| 9591742 | Interposer and semiconductor device including the same | Kei Murayama, Mitsutoshi Higashi, Koji Nagai | 2017-03-07 |
| 9451702 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2016-09-20 |
| 9434604 | Cap, semiconductor device including the cap, and manufacturing method therefor | Kosuke Fujihara | 2016-09-06 |
| 9052341 | Probe card and manufacturing method thereof | Akinori Shiraishi, Mitsutoshi Higashi | 2015-06-09 |
| 8922232 | Test-use individual substrate, probe, and semiconductor wafer testing apparatus | Shigeru Matsumura, Kohei Kato, Katsushi Sugai, Koichi Shiroyama, Mitsutoshi Higashi +1 more | 2014-12-30 |
| 8922234 | Probe card and method for manufacturing probe card | Akinori Shiraishi, Mitsutoshi Higashi | 2014-12-30 |
| 8810007 | Wiring board, semiconductor device, and method for manufacturing wiring board | Akihito Takano, Masahiro Sunohara, Mitsutoshi Higashi, Kenichi Ota, Yuichi Sasajima | 2014-08-19 |
| 8793868 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2014-08-05 |
| 8777638 | Wiring board and method of manufacturing the same | Akinori Shiraishi, Mitsutoshi Higashi | 2014-07-15 |
| 8759685 | Wiring substrate and method of manufacturing the wiring substrate | Akinori Shiraishi | 2014-06-24 |
| 8671561 | Substrate manufacturing method | Kiyoaki Iida, Kazuo Tanaka, Mitsutoshi Higashi | 2014-03-18 |
| 8669643 | Wiring board, semiconductor device, and method for manufacturing wiring board | Akihito Takano, Masahiro Sunohara, Mitsutoshi Higashi, Kenichi Ota, Yuichi Sasajima | 2014-03-11 |
| 8564077 | Package for electronic component, manufacturing method thereof and sensing apparatus | Akinori Shiraishi, Masahiro Sunohara, Yuichi Taguchi, Mitsutoshi Higashi | 2013-10-22 |
| 8536714 | Interposer, its manufacturing method, and semiconductor device | — | 2013-09-17 |
| 8350390 | Wiring substrate and semiconductor device | Kei Murayama, Masahiro Sunohara, Akinori Shiraishi | 2013-01-08 |
| 8330050 | Wiring board having heat intercepting member | Kei Murayama | 2012-12-11 |
| 8314344 | Wiring board and manufacturing method of the same | Akinori Shiraishi | 2012-11-20 |
| 8309860 | Electronic component built-in substrate and method of manufacturing the same | Masahiro Sunohara, Hiroshi Shimizu | 2012-11-13 |
| 8304862 | Semiconductor package and manufacturing method of the same | Yuichi Taguchi, Mitsutoshi Higashi, Akinori Shiraishi, Masahiro Sunohara | 2012-11-06 |
| 8299370 | Wiring board and method of manufacturing the same | Akinori Shiraishi, Mitsutoshi Higashi | 2012-10-30 |