Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134680 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2018-11-20 |
| 9768122 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2017-09-19 |
| 9451702 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2016-09-20 |
| 9137900 | Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate | Koichi Tanaka, Nobuyuki Kurashima, Tetsuya Koyama | 2015-09-15 |
| 9036362 | Electronic component incorporated substrate | Koichi Tanaka, Nobuyuki Kurashima, Satoshi Shiraki | 2015-05-19 |
| 8994134 | Electronic device and method of manufacturing the same | — | 2015-03-31 |
| 8987919 | Built-in electronic component substrate and method for manufacturing the substrate | Koichi Tanaka, Nobuyuki Kurashima, Satoshi Shiraki | 2015-03-24 |
| 8793868 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2014-08-05 |
| 8736053 | Semiconductor device | Koichi Tanaka, Nobuyuki Kurashima, Tetsuya Koyama | 2014-05-27 |
| 7989707 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2011-08-02 |
| 7884484 | Wiring board and method of manufacturing the same | Takaharu Yamano, Masahiro Sunohara, Tetsuya Koyama | 2011-02-08 |
| 7827681 | Method of manufacturing electronic component integrated substrate | Nobuyuki Kurashima, Tadashi Arai | 2010-11-09 |
| 7587727 | Pickup device | Yasuhito Kojima, Koichi Takezawa | 2009-09-08 |
| 6472745 | Semiconductor device | — | 2002-10-29 |
| 6380061 | Process for fabricating bump electrode | Syoichi Kobayashi, Naoyuki Koizumi, Osamu Uehara | 2002-04-30 |
| 6198169 | Semiconductor device and process for producing same | Syoichi Kobayashi, Naoyuki Koizumi, Osamu Uehara | 2001-03-06 |
| 5960308 | Process for making a chip sized semiconductor device | Masatoshi Akagawa, Mitsutoshi Higashi, Takehiko Arai | 1999-09-28 |
| 5834844 | Semiconductor device having an element with circuit pattern thereon | Masatoshi Akagawa, Mitsutoshi Higashi, Takehiko Arai | 1998-11-10 |
| 5777386 | Semiconductor device and mount structure thereof | Mitsutoshi Higashi, Kei Murayama | 1998-07-07 |
| 5198942 | Disc drive control device with accessing and power control | Zenjiro Uchida | 1993-03-30 |