Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134680 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2018-11-20 |
| 9768122 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2017-09-19 |
| 9451702 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2016-09-20 |
| 9257386 | Wiring substrate and semiconductor device | Hiromu Arisaka, Noriyoshi Shimizu, Masato Tanaka, Akio Rokugawa | 2016-02-09 |
| 9137900 | Electronic component incorporated substrate and method for manufacturing electronic component incorporated substrate | Koichi Tanaka, Nobuyuki Kurashima, Hajime Iizuka | 2015-09-15 |
| 9097606 | Imbalance correction method and imbalance correction amount calculation device for rotor | Nariyuki Kataoka | 2015-08-04 |
| 9059088 | Electronic component built-in substrate | Nobuyuki Kurashima, Hajime Ilzuka, Koichi Tanaka | 2015-06-16 |
| 8997526 | Vacuum degassing apparatus and vacuum degassing method for molten glass | Toru Nishikawa, Hironobu Yamamichi, Yuji Endo, Hajime Itoh | 2015-04-07 |
| 8793868 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2014-08-05 |
| 8736053 | Semiconductor device | Koichi Tanaka, Nobuyuki Kurashima, Hajime Iizuka | 2014-05-27 |
| 8468851 | Vacuum degassing apparatus and vacuum degassing method for molten glass | Toru Nishikawa, Hironobu Yamamichi, Yuji Endo, Hajime Itoh | 2013-06-25 |
| 8347654 | Vacuum degassing apparatus and vacuum degassing method for molten glass | Toru Nishikawa, Hironobu Yamamichi, Yuji Endo, Hajime Itoh | 2013-01-08 |
| 8096049 | Method of manufacturing a multilayer wiring board | Tsuyoshi Kobayashi, Hiroyuki Kato, Yoshihiro Machida | 2012-01-17 |
| 7989707 | Chip embedded substrate and method of producing the same | Takaharu Yamano, Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai +6 more | 2011-08-02 |
| 7955454 | Method for forming wiring on insulating resin layer | Takaharu Yamano, Kosaku Harayama, Hiroyuki Kato | 2011-06-07 |
| 7884484 | Wiring board and method of manufacturing the same | Takaharu Yamano, Masahiro Sunohara, Hajime Iizuka | 2011-02-08 |
| 7882627 | Method of manufacturing a multilayer wiring board | Tsuyoshi Kobayashi, Hiroyuki Kato, Yoshihiro Machida | 2011-02-08 |
| 7882619 | Method for setting stator coil | Kazuyuki Yamaguchi, Yusuke Niimi, Kenji Yoshida | 2011-02-08 |
| 7847384 | Semiconductor package and manufacturing method thereof | Tsuyoshi Kobayashi, Takaharu Yamano | 2010-12-07 |
| 7772689 | Semiconductor package with a conductive post and wiring pattern | Tsuyoshi Kobayashi, Takaharu Yamano | 2010-08-10 |
| 7501696 | Semiconductor chip-embedded substrate and method of manufacturing same | Tsuyoshi Kobayashi | 2009-03-10 |