Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430725 | Wiring board and method of manufacturing the same | Noriyoshi Shimizu, Wataru Kaneda | 2022-08-30 |
| 10978383 | Wiring board and method of manufacturing the same | Noriyoshi Shimizu, Wataru Kaneda | 2021-04-13 |
| 10366949 | Wiring substrate and semiconductor device | Noriyoshi Shimizu, Yusuke Gozu, Jun Furuichi, Takashi Ito | 2019-07-30 |
| 10028393 | Wiring substrate and semiconductor package | Noriyoshi Shimizu, Yusuke Gozu | 2018-07-17 |
| 9875957 | Wiring substrate and semiconductor device | Noriyoshi Shimizu, Yusuke Gozu, Jun Furuichi, Takashi Ito | 2018-01-23 |
| 9820391 | Wiring board | Noriyoshi Shimizu, Shoji Watanabe, Toshinori Koyama | 2017-11-14 |
| 9735098 | Wiring substrate and semiconductor device | Hiromu Arisaka, Noriyoshi Shimizu | 2017-08-15 |
| 9620446 | Wiring board, electronic component device, and method for manufacturing those | Noriyoshi Shimizu, Hiromu Arisaka, Toshinori Koyama | 2017-04-11 |
| 9565775 | Wiring board, semiconductor device, and method of manufacturing wiring board | Noriyoshi Shimizu, Wataru Kaneda, Hiromu Arisaka | 2017-02-07 |
| 9520352 | Wiring board and semiconductor device | Hiromu Arisaka, Noriyoshi Shimizu, Toshinori Koyama | 2016-12-13 |
| 9455219 | Wiring substrate and method of manufacturing the same | Noriyoshi Shimizu, Wataru Kaneda, Toshinori Koyama | 2016-09-27 |
| 9380707 | Method of manufacturing wiring substrate | Noriyoshi Shimizu, Toshinori Koyama, Wataru Kaneda | 2016-06-28 |
| 9257386 | Wiring substrate and semiconductor device | Hiromu Arisaka, Noriyoshi Shimizu, Masato Tanaka, Tetsuya Koyama | 2016-02-09 |
| 9220167 | Wiring substrate, semiconductor device, and method of manufacturing wiring substrate | Noriyoshi Shimizu, Masato Tanaka, Toshinori Koyama | 2015-12-22 |
| 9167692 | Wiring board, semiconductor device, and method of manufacturing wiring board | Noriyoshi Shimizu, Toshinori Koyama | 2015-10-20 |
| 9148952 | Wiring board | Noriyoshi Shimizu, Hitoshi Sakaguchi, Wataru Kaneda, Masato Tanaka | 2015-09-29 |
| 9119319 | Wiring board, semiconductor device, and method for manufacturing wiring board | Wataru Kaneda, Noriyoshi Shimizu, Kaori Yokota | 2015-08-25 |
| 9054082 | Semiconductor package, semiconductor device, and method for manufacturing semiconductor package | Noriyoshi Shimizu, Akihiko Tateiwa, Masato Tanaka | 2015-06-09 |
| 9000302 | Wiring board | Noriyoshi Shimizu, Hitoshi Sakaguchi, Wataru Kaneda, Masato Tanaka | 2015-04-07 |
| 8994193 | Semiconductor package including a metal plate, semiconductor chip, and wiring structure, semiconductor apparatus and method for manufacturing semiconductor package | Akihiko Tateiwa, Masato Tanaka | 2015-03-31 |
| 8823187 | Semiconductor package, semiconductor package manufacturing method and semiconductor device | Noriyoshi Shimizu, Osamu Inoue | 2014-09-02 |
| 8791561 | Semiconductor device and its manufacture method | Sadahiro Kishii, Tsuyoshi Kanki, Yoshihiro Nakata, Yasushi Kobayashi, Masato Tanaka | 2014-07-29 |
| 8785256 | Method of manufacturing semiconductor package | Noriyoshi Shimizu | 2014-07-22 |
| 8581421 | Semiconductor package manufacturing method and semiconductor package | Noriyoshi Shimizu, Hirokazu Yoshino | 2013-11-12 |
| 8399295 | Semiconductor device and its manufacture method | Sadahiro Kishii, Tsuyoshi Kanki, Yoshihiro Nakata, Yasushi Kobayashi, Masato Tanaka | 2013-03-19 |