Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8378492 | Semiconductor package | Noriyoshi Shimizu | 2013-02-19 |
| 8288875 | Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch | Noriyoshi Shimizu | 2012-10-16 |
| 7763809 | Multilayered substrate for semiconductor device and method of manufacturing same | Masayuki Sasaki, Yuichi Matsuda | 2010-07-27 |
| 7536780 | Method of manufacturing wiring substrate to which semiconductor chip is mounted | Noriyoshi Shimizu, Tomoo Yamasaki, Kiyoshi Oi | 2009-05-26 |
| 7402900 | Semiconductor device substrate, semiconductor device, and manufacturing method thereof | Kiyoshi Ooi, Yasuyoshi Horikawa | 2008-07-22 |
| 7358114 | Semiconductor device substrate, semiconductor device, and manufacturing method thereof | Kiyoshi Ooi, Yasuyoshi Horikawa | 2008-04-15 |
| 7352060 | Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate | Noriyoshi Shimizu, Tomoo Yamasaki, Takahiro Iijima | 2008-04-01 |
| 7341919 | Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device | Tomoo Yamasaki | 2008-03-11 |
| 7335531 | Semiconductor device package and method of production and semiconductor device of same | Takahiro Iijima | 2008-02-26 |
| 7314780 | Semiconductor package, method of production of same, and semiconductor device | Noriyoshi Shimizu, Takahiro Iijima | 2008-01-01 |
| 7282419 | Thin-film capacitor device, mounting module for the same, and method for fabricating the same | Tomoo Yamasaki, Kiyoshi Ooi | 2007-10-16 |
| 7250355 | Multilayered circuit substrate, semiconductor device and method of producing same | Takahiro Iijima | 2007-07-31 |
| 7161242 | Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element | Tomoo Yamasaki, Akihito Takano, Kiyoshi Ooi | 2007-01-09 |
| 7115931 | Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device | Tomoo Yamasaki | 2006-10-03 |
| 7078269 | Substrate fabrication method and substrate | Tomoo Yamasaki | 2006-07-18 |
| 7033934 | Method of production of semiconductor package | Takahiro Iijima | 2006-04-25 |
| 7019404 | Multilayered circuit substrate, semiconductor device and method of producing same | Takahiro Iijima | 2006-03-28 |
| 6999299 | Capacitor structure, a multi-layer wiring board including the same, and a semiconductor device using the multi-layer wiring board | Noriyoshi Shimizu, Tomoo Yamasaki, Kiyoshi Ooi | 2006-02-14 |
| 6979854 | Thin-film capacitor device, mounting module for the same, and method for fabricating the same | Tomoo Yamasaki, Kiyoshi Ooi | 2005-12-27 |
| 6931724 | Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon | Masayuki Sasaki, Yuichi Matsuda | 2005-08-23 |
| 6921977 | Semiconductor package, method of production of same, and semiconductor device | Noriyoshi Shimizu, Takahiro Iijima | 2005-07-26 |
| 6914322 | Semiconductor device package and method of production and semiconductor device of same | Takahiro Iijima | 2005-07-05 |
| 6884655 | Semiconductor package, method of manufacturing the same, and semiconductor device | Takahiro Iljima, Noriyoshi Shimizu | 2005-04-26 |
| 6828224 | Method of fabricating substrate utilizing an electrophoretic deposition process | Takahiro Iijima, Noriyoshi Shimizu | 2004-12-07 |
| 6783652 | Process for manufacturing a wiring board | Takahiro Iijima, Yasuyoshi Horikawa | 2004-08-31 |