Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462501 | Interconnect substrate and method of making the same | Ryo Fukasawa | 2022-10-04 |
| 10261110 | Probe guide plate having a silicon oxide layer formed on surfaces and on an inner wall of a through hole thereof, and a protective insulating layer formed on the silicon oxide layer, and probe apparatus including the probe guide plate | Yuichiro Shimizu, Kosuke Fujihara, Chikaomi Mori | 2019-04-16 |
| 9780032 | Wiring substrate | Kazuhiro Fujita | 2017-10-03 |
| 9006586 | Wiring substrate, its manufacturing method, and semiconductor device | Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda | 2015-04-14 |
| 8878077 | Wiring substrate and method of manufacturing the same | Takashi Ito, Yuta Sakaguchi | 2014-11-04 |
| 8729401 | Wiring substrate and method of manufacturing the same | Michio Horiuchi | 2014-05-20 |
| 8638542 | Capacitor containing a large number of filamentous conductors and method of manufacturing the same | Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Yukio Shimizu, Yuta Sakaguchi | 2014-01-28 |
| 8288659 | Wiring board and manufacturing method thereof | — | 2012-10-16 |
| 8242612 | Wiring board having piercing linear conductors and semiconductor device using the same | Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Yuta Sakaguchi | 2012-08-14 |
| 8138609 | Semiconductor device and method of manufacturing semiconductor device | Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Yuta Sakaguchi | 2012-03-20 |
| 8066862 | Manufacturing method of wiring board | Katsuya Fukase | 2011-11-29 |
| 7536780 | Method of manufacturing wiring substrate to which semiconductor chip is mounted | Noriyoshi Shimizu, Kiyoshi Oi, Akio Rokugawa | 2009-05-26 |
| 7531011 | Method of manufacturing capacitor device | — | 2009-05-12 |
| 7403370 | Capacitor parts | Kiyoshi Oi, Noriyoshi Shimizu | 2008-07-22 |
| 7375022 | Method of manufacturing wiring board | Kiyoshi Oi, Noriyoshi Shimizu | 2008-05-20 |
| 7352060 | Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate | Noriyoshi Shimizu, Akio Rokugawa, Takahiro Iijima | 2008-04-01 |
| 7341919 | Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device | Akio Rokugawa | 2008-03-11 |
| 7284307 | Method for manufacturing wiring board | Noriyoshi Shimizu, Kiyoshi Oi | 2007-10-23 |
| 7282419 | Thin-film capacitor device, mounting module for the same, and method for fabricating the same | Kiyoshi Ooi, Akio Rokugawa | 2007-10-16 |
| 7223652 | Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device | Kiyoshi Ooi, Yasuyoshi Horikawa | 2007-05-29 |
| 7161242 | Semiconductor device, semiconductor device substrate, and manufacturing method thereof that can increase reliability in mounting a semiconductor element | Akio Rokugawa, Akihito Takano, Kiyoshi Ooi | 2007-01-09 |
| 7115931 | Capacitor element, manufacturing method therefor, semiconductor device substrate, and semiconductor device | Akio Rokugawa | 2006-10-03 |
| 7078269 | Substrate fabrication method and substrate | Akio Rokugawa | 2006-07-18 |
| 7079371 | Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device | — | 2006-07-18 |
| 7072168 | Capacitor device and method of manufacturing the same | Yasuyoshi Horikawa, Kiyoshi Ooi | 2006-07-04 |