Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176280 | Interconnect substrate and method of making interconnect substrate | — | 2024-12-24 |
| 11528810 | Wiring board | Yoko NAKABAYASHI | 2022-12-13 |
| 10262946 | Wiring substrate and semiconductor device | Yusuke Gozu, Norikazu Nakamura, Noriyoshi Shimizu | 2019-04-16 |
| 9961760 | Wiring substrate | Yusuke Gozu, Noriyoshi Shimizu | 2018-05-01 |
| 9741652 | Wiring substrate | Yusuke Gozu, Noriyoshi Shimizu | 2017-08-22 |
| 8878077 | Wiring substrate and method of manufacturing the same | Takashi Ito, Tomoo Yamasaki | 2014-11-04 |
| 8638542 | Capacitor containing a large number of filamentous conductors and method of manufacturing the same | Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Yukio Shimizu, Tomoo Yamasaki | 2014-01-28 |
| 8242612 | Wiring board having piercing linear conductors and semiconductor device using the same | Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Tomoo Yamasaki | 2012-08-14 |
| 8138609 | Semiconductor device and method of manufacturing semiconductor device | Michio Horiuchi, Yasue Tokutake, Yuichi Matsuda, Tomoo Yamasaki | 2012-03-20 |