Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10858507 | Fiber-reinforced polypropylene-based resin composition and molded product thereof | — | 2020-12-08 |
| 9921874 | Storage medium, information processing device, and information processing method | Haruyasu Ueda | 2018-03-20 |
| 9698037 | Substrate processing apparatus | Seiyo Nakashima, Takashi Nogami, Shinobu Sugiura, Tomoyuki Yamada | 2017-07-04 |
| 9535743 | Data processing control method, computer-readable recording medium, and data processing control device for performing a Mapreduce process | Nobuyuki KUROMATSU, Haruyasu Ueda | 2017-01-03 |
| 9488677 | Probe card having a wiring substrate | Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Mitsuhiro Aizawa | 2016-11-08 |
| 9476913 | Probe card | Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Mitsuhiro Aizawa | 2016-10-25 |
| 9470718 | Probe card | Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake, Mitsuhiro Aizawa | 2016-10-18 |
| 9460983 | Joining structure using thermal interface material | Michio Horiuchi, Yasue Tokutake | 2016-10-04 |
| 9459289 | Probe card and method for manufacturing probe card | Michio Horiuchi, Ryo Fukasawa, Yasue Tokutake | 2016-10-04 |
| 9373587 | Stacked electronic device | Michio Horiuchi, Ryo Fukasawa, Yasue Tokutake | 2016-06-21 |
| 9344347 | Delay time measuring apparatus, computer readable record medium on which delay time measuring program is recorded, and delay time measuring method | Yuji Nomura | 2016-05-17 |
| 9202781 | Wiring substrate, method for manufacturing wiring substrate, and semiconductor package | Yuko Karasawa, Kazue Ban, Ryo Fukasawa, Michio Horiuchi, Yasue Tokutake | 2015-12-01 |
| 9204544 | Wiring substrate and method of manufacturing the same | Michio Horiuchi, Ryo Fukasawa, Yasue Tokutake | 2015-12-01 |
| 9006586 | Wiring substrate, its manufacturing method, and semiconductor device | Michio Horiuchi, Yasue Tokutake, Tomoo Yamasaki | 2015-04-14 |
| 8832496 | Information managing computer product, apparatus, and method | Yuji Nomura | 2014-09-09 |
| 8664764 | Semiconductor device including a core substrate and a semiconductor element | Michio Horiuchi, Yasue Tokutake | 2014-03-04 |
| 8638542 | Capacitor containing a large number of filamentous conductors and method of manufacturing the same | Michio Horiuchi, Yasue Tokutake, Yukio Shimizu, Tomoo Yamasaki, Yuta Sakaguchi | 2014-01-28 |
| 8362369 | Wiring board | Michio Horiuchi, Yasue Tokutake, Masao Nakazawa | 2013-01-29 |
| 8324513 | Wiring substrate and semiconductor apparatus including the wiring substrate | Michio Horiuchi, Yasue Tokutake | 2012-12-04 |
| 8242612 | Wiring board having piercing linear conductors and semiconductor device using the same | Michio Horiuchi, Yasue Tokutake, Tomoo Yamasaki, Yuta Sakaguchi | 2012-08-14 |
| 8138609 | Semiconductor device and method of manufacturing semiconductor device | Michio Horiuchi, Yasue Tokutake, Tomoo Yamasaki, Yuta Sakaguchi | 2012-03-20 |
| 7847021 | Aliphatic polyester resin composition containing copolymer | Hosei Shinoda, Takeshi Kashima, Masahiro Enna, Shinichi Kojoh, Hideyuki Kaneko +5 more | 2010-12-07 |
| 7763809 | Multilayered substrate for semiconductor device and method of manufacturing same | Akio Rokugawa, Masayuki Sasaki | 2010-07-27 |
| 7725548 | Computer-readable recording medium recording communication programs, communication method and communication apparatus | Takeshi Ohtani, Yutaka Iwayama | 2010-05-25 |
| 7482063 | Molded object obtained by in-mold coating and process for producing the same | Takeshi Minoda, Kaoru Yorita, Kenji Yonemochi, Kenji Oota, Etsuo Okahara +1 more | 2009-01-27 |