Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9202781 | Wiring substrate, method for manufacturing wiring substrate, and semiconductor package | Kazue Ban, Ryo Fukasawa, Yuichi Matsuda, Michio Horiuchi, Yasue Tokutake | 2015-12-01 |