MH

Michio Horiuchi

SC Shinko Electric Industries Co.: 92 patents #4 of 723Top 1%
KT Kabushiki Kaisha Toshiba: 2 patents #9,982 of 21,451Top 50%
Overall (All Time): #16,780 of 4,157,543Top 1%
93
Patents All Time

Issued Patents All Time

Showing 1–25 of 93 patents

Patent #TitleCo-InventorsDate
12424476 Electrostatic chuck, substrate fixing device and paste Ryosuke Hori 2025-09-23
12400893 Substrate detaching apparatus Shinji Nakazawa 2025-08-26
12077701 Ultraviolet detection device comprising a ceramic substrate and composite oxides Masaya Tsuno 2024-09-03
11978831 Light emitting device Masaya Tsuno 2024-05-07
11952316 Composite green sheet and ceramic member Tomotake Minemura 2024-04-09
11811009 Light emitting device with wiring enclosed by ceramic substrate Yuichiro Shimizu, Masaya Tsuno 2023-11-07
11733162 Ultraviolet detection material and ultraviolet detection device Masaya Tsuno 2023-08-22
11721574 Member for electrostatic chuck and electrostatic chuck Masaya Tsuno 2023-08-08
11437263 Electrostatic chuck and substrate fixing device Masaya Tsuno 2022-09-06
11370709 Ceramic member Tomotake Minemura 2022-06-28
10998216 Sintered body and electrostatic chuck Masakuni Miyazawa 2021-05-04
9960120 Wiring substrate with buried substrate having linear conductors Ryo Fukasawa, Sumihiro Ichikawa 2018-05-01
9721876 Semiconductor device and method of making the same Ryo Fukasawa 2017-08-01
9488677 Probe card having a wiring substrate Ryo Fukasawa, Yasue Tokutake, Yuichi Matsuda, Mitsuhiro Aizawa 2016-11-08
9476913 Probe card Ryo Fukasawa, Yasue Tokutake, Yuichi Matsuda, Mitsuhiro Aizawa 2016-10-25
9470718 Probe card Ryo Fukasawa, Yasue Tokutake, Yuichi Matsuda, Mitsuhiro Aizawa 2016-10-18
9459289 Probe card and method for manufacturing probe card Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake 2016-10-04
9460983 Joining structure using thermal interface material Yasue Tokutake, Yuichi Matsuda 2016-10-04
9373587 Stacked electronic device Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake 2016-06-21
9204544 Wiring substrate and method of manufacturing the same Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake 2015-12-01
9202781 Wiring substrate, method for manufacturing wiring substrate, and semiconductor package Yuko Karasawa, Kazue Ban, Ryo Fukasawa, Yuichi Matsuda, Yasue Tokutake 2015-12-01
9029041 Solid oxide fuel cell Yasue Tokutake, Shigeaki Suganuma, Jun Yoshiike, Fumimasa Katagiri 2015-05-12
9006586 Wiring substrate, its manufacturing method, and semiconductor device Yasue Tokutake, Yuichi Matsuda, Tomoo Yamasaki 2015-04-14
8729401 Wiring substrate and method of manufacturing the same Tomoo Yamasaki 2014-05-20
8664764 Semiconductor device including a core substrate and a semiconductor element Yasue Tokutake, Yuichi Matsuda 2014-03-04