Issued Patents All Time
Showing 51–75 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7005207 | Fuel cell | Shigeaki Suganuma, Misa Watanabe, Shuji Yamazaki | 2006-02-28 |
| 6849945 | Multi-layered semiconductor device and method for producing the same | Takashi Kurihara, Shigeru Mizuno | 2005-02-01 |
| 6774467 | Semiconductor device and process of production of same | Takashi Kurihara, Tomio Nagaoka, Masao Aoki, Shigeru Mizuno | 2004-08-10 |
| 6731010 | Resin sealed stacked semiconductor packages with flat surfaces | Takashi Kurihara | 2004-05-04 |
| 6660942 | Semiconductor device with an exposed external-connection terminal | Takashi Kurihara | 2003-12-09 |
| 6599654 | Fuel cell and multi-element stack therefor | Shigeaki Suganuma, Misa Watanabe, Shuji Yamazaki | 2003-07-29 |
| 6522017 | Wiring board and semiconductor device | Takashi Kurihara | 2003-02-18 |
| 6518672 | Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate | Takashi Kurihara, Shigeru Mizuno, Yuka Tamadate | 2003-02-11 |
| 6469260 | Wiring boards, semiconductor devices and their production processes | Takashi Kurihara | 2002-10-22 |
| 6465886 | Semiconductor device having circuit pattern and lands thereon | Shigetsugu Muramatsu | 2002-10-15 |
| 6455786 | Wiring board and manufacturing method thereof and semiconductor device | Shigetsugu Muramatsu, Shigeru Mizuno, Takashi Kurihara | 2002-09-24 |
| 6452115 | Circuit pattern for multi-layer circuit board for mounting electronic parts | Eiji Yoda, Chiaki Takubo | 2002-09-17 |
| 6429517 | Semiconductor device and fabrication method thereof | Mohan Kirloskar, Yukiharu Takeuchi | 2002-08-06 |
| 6407344 | Multilayer circuit board | Takashi Kurihara | 2002-06-18 |
| 6407460 | Multilayer circuit board | Shigeru Mizuno | 2002-06-18 |
| 6404214 | Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic device | Shigetsugu Muramatsu, Takuya Kazama | 2002-06-11 |
| 6335493 | Multilayer wiring board | Shigetsugu Muramatsu | 2002-01-01 |
| 6297553 | Semiconductor device and process for producing the same | Kazunari Imai | 2001-10-02 |
| 6271483 | Wiring board having vias | Toshiaki Suyama, Masakuni Tokita | 2001-08-07 |
| 6271478 | Multi-layer circuit board | Yukiharu Takeuchi, Chiaki Takubo | 2001-08-07 |
| 6256207 | Chip-sized semiconductor device and process for making same | Shigetsugu Muramatsu | 2001-07-03 |
| 6242799 | Anisotropic stress buffer and semiconductor device using the same | Shigetsugu Muramatsu | 2001-06-05 |
| 6236112 | Semiconductor device, connecting substrate therefor, and process of manufacturing connecting substrate | Takuya Kazama | 2001-05-22 |
| 6229099 | Multi-layer circuit board with particular pad spacing | Eiji Yoda, Chiaki Takubo | 2001-05-08 |
| 6221749 | Semiconductor device and production thereof | Mohan Kirloskar, Yukiharu Takeuchi | 2001-04-24 |