| 7732914 |
Cavity-type integrated circuit package |
Neil McLellan, Katherine Wagenhoffer, Geraldine Tsui Yee Lin |
2010-06-08 |
| 7411289 |
Integrated circuit package with partially exposed contact pads and process for fabricating the same |
Neil McLellan, Geraldine Tsui Yee Lin, Chun Ho Fan, Ed A. Varga |
2008-08-12 |
| 7381588 |
Shielded integrated circuit package |
Viresh Piyush Patel |
2008-06-03 |
| 7371610 |
Process for fabricating an integrated circuit package with reduced mold warping |
Chun Ho Fan, Neil McLellan |
2008-05-13 |
| 7348663 |
Integrated circuit package and method for fabricating same |
Katherine Wagenhoffer, Leo M. Higgins, III |
2008-03-25 |
| 7344920 |
Integrated circuit package and method for fabricating same |
Katherine Wagenhoffer, Leo M. Higgins, III |
2008-03-18 |
| 7342305 |
Thermally enhanced cavity-down integrated circuit package |
Qizhong Diao, Neil McLellan |
2008-03-11 |
| 7315080 |
Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader |
Chun Ho Fan, Wing Keung Lam, Ming Wang Sze, Sadak Thamby Labeeb, Neil McLellan |
2008-01-01 |
| 7091581 |
Integrated circuit package and process for fabricating the same |
Neil McLellan, Geraldine Tsui Yee Lin, Chun Ho Fan, Ed A. Varga |
2006-08-15 |
| 7081403 |
Thin leadless plastic chip carrier |
Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan |
2006-07-25 |
| 7071545 |
Shielded integrated circuit package |
Viresh Piyush Patel |
2006-07-04 |
| 7033517 |
Method of fabricating a leadless plastic chip carrier |
Chun Ho Fan |
2006-04-25 |
| 7009286 |
Thin leadless plastic chip carrier |
Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan |
2006-03-07 |
| 6987032 |
Ball grid array package and process for manufacturing same |
Chun Ho Fan, Wing Keung Lam, Ming Wang Sze, Sadak Thamby Labeeb, Neil McLellan |
2006-01-17 |
| 6984785 |
Thermally enhanced cavity-down integrated circuit package |
Qizhong Diao, Neil McLellan |
2006-01-10 |
| 6933176 |
Ball grid array package and process for manufacturing same |
Chun Ho Fan, Neil McLellan |
2005-08-23 |
| 6777971 |
High speed wafer sort and final test |
Albert Alcorn |
2004-08-17 |
| 6429517 |
Semiconductor device and fabrication method thereof |
Michio Horiuchi, Yukiharu Takeuchi |
2002-08-06 |
| 6221749 |
Semiconductor device and production thereof |
Michio Horiuchi, Yukiharu Takeuchi |
2001-04-24 |
