Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7732914 | Cavity-type integrated circuit package | Neil McLellan, Katherine Wagenhoffer, Geraldine Tsui Yee Lin | 2010-06-08 |
| 7411289 | Integrated circuit package with partially exposed contact pads and process for fabricating the same | Neil McLellan, Geraldine Tsui Yee Lin, Chun Ho Fan, Ed A. Varga | 2008-08-12 |
| 7381588 | Shielded integrated circuit package | Viresh Piyush Patel | 2008-06-03 |
| 7371610 | Process for fabricating an integrated circuit package with reduced mold warping | Chun Ho Fan, Neil McLellan | 2008-05-13 |
| 7348663 | Integrated circuit package and method for fabricating same | Katherine Wagenhoffer, Leo M. Higgins, III | 2008-03-25 |
| 7344920 | Integrated circuit package and method for fabricating same | Katherine Wagenhoffer, Leo M. Higgins, III | 2008-03-18 |
| 7342305 | Thermally enhanced cavity-down integrated circuit package | Qizhong Diao, Neil McLellan | 2008-03-11 |
| 7315080 | Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader | Chun Ho Fan, Wing Keung Lam, Ming Wang Sze, Sadak Thamby Labeeb, Neil McLellan | 2008-01-01 |
| 7091581 | Integrated circuit package and process for fabricating the same | Neil McLellan, Geraldine Tsui Yee Lin, Chun Ho Fan, Ed A. Varga | 2006-08-15 |
| 7081403 | Thin leadless plastic chip carrier | Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan | 2006-07-25 |
| 7071545 | Shielded integrated circuit package | Viresh Piyush Patel | 2006-07-04 |
| 7033517 | Method of fabricating a leadless plastic chip carrier | Chun Ho Fan | 2006-04-25 |
| 7009286 | Thin leadless plastic chip carrier | Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan | 2006-03-07 |
| 6987032 | Ball grid array package and process for manufacturing same | Chun Ho Fan, Wing Keung Lam, Ming Wang Sze, Sadak Thamby Labeeb, Neil McLellan | 2006-01-17 |
| 6984785 | Thermally enhanced cavity-down integrated circuit package | Qizhong Diao, Neil McLellan | 2006-01-10 |
| 6933176 | Ball grid array package and process for manufacturing same | Chun Ho Fan, Neil McLellan | 2005-08-23 |
| 6777971 | High speed wafer sort and final test | Albert Alcorn | 2004-08-17 |
| 6429517 | Semiconductor device and fabrication method thereof | Michio Horiuchi, Yukiharu Takeuchi | 2002-08-06 |
| 6221749 | Semiconductor device and production thereof | Michio Horiuchi, Yukiharu Takeuchi | 2001-04-24 |