Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7411289 | Integrated circuit package with partially exposed contact pads and process for fabricating the same | Neil McLellan, Geraldine Tsui Yee Lin, Chun Ho Fan, Mohan Kirloskar | 2008-08-12 |
| 7091581 | Integrated circuit package and process for fabricating the same | Neil McLellan, Geraldine Tsui Yee Lin, Chun Ho Fan, Mohan Kirloskar | 2006-08-15 |