Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan +1 more | 2016-12-13 |
| 8330270 | Integrated circuit package having a plurality of spaced apart pad portions | Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan +1 more | 2012-12-11 |
| 7732914 | Cavity-type integrated circuit package | Neil McLellan, Katherine Wagenhoffer, Mohan Kirloskar | 2010-06-08 |
| 7411289 | Integrated circuit package with partially exposed contact pads and process for fabricating the same | Neil McLellan, Chun Ho Fan, Mohan Kirloskar, Ed A. Varga | 2008-08-12 |
| 7091581 | Integrated circuit package and process for fabricating the same | Neil McLellan, Chun Ho Fan, Mohan Kirloskar, Ed A. Varga | 2006-08-15 |
| 6903304 | Process for dressing molded array package saw blade | Neil McLellan, Chun Ho Fan, John Ping Sheung Lau | 2005-06-07 |