Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Geraldine Tsui Yee Lin, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan +1 more | 2016-12-13 |
| 8330270 | Integrated circuit package having a plurality of spaced apart pad portions | Geraldine Tsui Yee Lin, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan +1 more | 2012-12-11 |