| 9520306 |
Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion |
Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Kwok Cheung Tsang, Chun Ho Fan +1 more |
2016-12-13 |
| 8330270 |
Integrated circuit package having a plurality of spaced apart pad portions |
Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Kwok Cheung Tsang, Chun Ho Fan +1 more |
2012-12-11 |
| 7449771 |
Multiple leadframe laminated IC package |
Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Shuk Man Wong |
2008-11-11 |
| 7270867 |
Leadless plastic chip carrier |
Kin Pui Kwan, Kwok Cheung Tsang, Chun Ho Fan, Neil McLellan |
2007-09-18 |
| 7271032 |
Leadless plastic chip carrier with etch back pad singulation |
Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan |
2007-09-18 |
| 7247526 |
Process for fabricating an integrated circuit package |
Chun Ho Fan, Neil McLellan, Emily Shui Ming Tse |
2007-07-24 |
| 7226811 |
Process for fabricating a leadless plastic chip carrier |
Neil McLellan, Chun Ho Fan, Kin Pui Kwan |
2007-06-05 |
| 7049177 |
Leadless plastic chip carrier with standoff contacts and die attach pad |
Chun Ho Fan, Kenneth Kwan, Janet Wong |
2006-05-23 |
| 6995460 |
Leadless plastic chip carrier with etch back pad singulation |
Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan |
2006-02-07 |
| 6989294 |
Leadless plastic chip carrier with etch back pad singulation |
Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan |
2006-01-24 |
| 6946324 |
Process for fabricating a leadless plastic chip carrier |
Neil McLellan, Chun Ho Fan, Kin Pui Kwan |
2005-09-20 |
| 6933594 |
Leadless plastic chip carrier with etch back pad singulation |
Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Kin Pui Kwan |
2005-08-23 |
| 6872661 |
Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
Kin Pui Kwan, Kwok Cheung Tsang, Chun Ho Fan, Neil McLellan |
2005-03-29 |
| 6734044 |
Multiple leadframe laminated IC package |
Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Shuk Man Wong |
2004-05-11 |
| 6667191 |
Chip scale integrated circuit package |
Neil McLellan, Tak Sang Yeung, Onofre A. Rulloda, Jr. |
2003-12-23 |
| 6635957 |
Leadless plastic chip carrier with etch back pad singulation and die attach pad array |
Kin Pui Kwan, Kwok Cheung Tsang, Chun Ho Fan, Neil McLellan |
2003-10-21 |