Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7449771 | Multiple leadframe laminated IC package | Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau | 2008-11-11 |
| 6734044 | Multiple leadframe laminated IC package | Chun Ho Fan, Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau | 2004-05-11 |