TY

Tak Sang Yeung

A- A-Sat: 4 patents #11 of 49Top 25%
Broadcom: 1 patents #5,847 of 9,346Top 65%
📍 Tin Shui Wai, CA: #2 of 2 inventorsTop 100%
Overall (All Time): #1,005,227 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
9123698 Flexural plate wave device for chip cooling Milind S. Bhagavat, Seyed Mahdi Saeidi 2015-09-01
7224048 Flip chip ball grid array package Neil McLellan 2007-05-29
6818472 Ball grid array package Chun Ho Fan, Joseph Martin, Ming Wang Sze 2004-11-16
6800948 Ball grid array package Chun Ho Fan, Joseph Martin, Ming Wang Sze 2004-10-05
6667191 Chip scale integrated circuit package Neil McLellan, Wing Him Lau, Onofre A. Rulloda, Jr. 2003-12-23