Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9123698 | Flexural plate wave device for chip cooling | Milind S. Bhagavat, Tak Sang Yeung | 2015-09-01 |
| 9041192 | Hybrid thermal interface material for IC packages with integrated heat spreader | Sam Ziqun Zhao | 2015-05-26 |