Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12322690 | Circuit packages and fabrication methods using bond-on-pad (BoP) substrate technology | Wen-Hsien Huang | 2025-06-03 |
| 9806006 | Etch isolation LPCC/QFN strip | Tung Lok Li, Kin Pui Kwan | 2017-10-31 |
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Chun Ho Fan +1 more | 2016-12-13 |
| 9449903 | Ball grid array package with improved thermal characteristics | Neil McLellan, Ming Wang Sze, Wing Keung Lam, Wai Kit Tam | 2016-09-20 |
| 9373576 | Flip chip pad geometry for an IC package substrate | — | 2016-06-21 |
| 8610262 | Ball grid array package with improved thermal characteristics | Neil McLellan, Ming Wang Sze, Wing Keung Lam, Wai Kit Tam | 2013-12-17 |
| 8330270 | Integrated circuit package having a plurality of spaced apart pad portions | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Chun Ho Fan +1 more | 2012-12-11 |
| 7482690 | Electronic components such as thin array plastic packages and process for fabricating same | Chun Ho Fan | 2009-01-27 |
| 7439099 | Thin ball grid array package | Chun Ho Fan, William Lap Keung Chow | 2008-10-21 |
| 7372151 | Ball grid array package and process for manufacturing same | Chun Ho Fan, Neil McLellan | 2008-05-13 |
| 7358119 | Thin array plastic package without die attach pad and process for fabricating the same | Neil McLellan, Serafin P. Pedron, Jr., Leo M. Higgins, III, Kin Pui Kwan | 2008-04-15 |
| 7270867 | Leadless plastic chip carrier | Kin Pui Kwan, Wing Him Lau, Chun Ho Fan, Neil McLellan | 2007-09-18 |
| 7271032 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Chun Ho Fan, Kin Pui Kwan, Wing Him Lau | 2007-09-18 |
| 7232755 | Process for fabricating pad frame and integrated circuit package | Neil McLellan, Chun Ho Fan, Kin Pui Kwan | 2007-06-19 |
| 7081403 | Thin leadless plastic chip carrier | Mohan Kirloskar, Chun Ho Fan, Kin Pui Kwan | 2006-07-25 |
| 7009286 | Thin leadless plastic chip carrier | Mohan Kirloskar, Chun Ho Fan, Kin Pui Kwan | 2006-03-07 |
| 6995460 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Chun Ho Fan, Kin Pui Kwan, Wing Him Lau | 2006-02-07 |
| 6989294 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Chun Ho Fan, Kin Pui Kwan, Wing Him Lau | 2006-01-24 |
| 6964918 | Electronic components such as thin array plastic packages and process for fabricating same | Chun Ho Fan | 2005-11-15 |
| 6933594 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Chun Ho Fan, Kin Pui Kwan, Wing Him Lau | 2005-08-23 |
| 6872661 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Wing Him Lau, Chun Ho Fan, Neil McLellan | 2005-03-29 |
| 6781242 | Thin ball grid array package | Chun Ho Fan, William Lap Keung Chow | 2004-08-24 |
| 6635957 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Kin Pui Kwan, Wing Him Lau, Chun Ho Fan, Neil McLellan | 2003-10-21 |
| 6586834 | Die-up tape ball grid array package | Ming Wang Sze, Wing Keung Lam, Kin-wai Wong | 2003-07-01 |
| 6429048 | Metal foil laminated IC package | Neil McLellan, Chun Ho Fan, Pik Ling Lau | 2002-08-06 |