Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6737755 | Ball grid array package with improved thermal characteristics | Neil McLellan, Ming Wang Sze, Wing Keung Lam | 2004-05-18 |
| 6586834 | Die-up tape ball grid array package | Ming Wang Sze, Kwok Cheung Tsang, Wing Keung Lam | 2003-07-01 |