Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806006 | Etch isolation LPCC/QFN strip | Kwok Cheung Tsang, Kin Pui Kwan | 2017-10-31 |
| 9337095 | Method of manufacturing leadless integrated circuit packages having electrically routed contacts | — | 2016-05-10 |
| 8569110 | Pre-bonded substrate for integrated circuit package and method of making the same | John R. McMillan, Xiao Chen | 2013-10-29 |
| 8513786 | Pre-bonded substrate for integrated circuit package and method of making the same | John R. McMillan, Xiao Chen | 2013-08-20 |
| 8497159 | Method of manufacturing leadless integrated circuit packages having electrically routed contacts | — | 2013-07-30 |
| 8338924 | Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof | John R. McMillan, Xiao Chen | 2012-12-25 |
| 8124462 | Enhanced integrated circuit package | — | 2012-02-28 |
| 8072053 | Leadless integrated circuit package having electrically routed contacts | — | 2011-12-06 |
| 7973394 | Enhanced integrated circuit package | — | 2011-07-05 |
| 7875970 | Integrated circuit package having a castellated heatspreader | — | 2011-01-25 |
| 5531860 | Structure and method for providing a lead frame with enhanced solder wetting leads | — | 1996-07-02 |
| 5444293 | Structure and method for providing a lead frame with enhanced solder wetting leads | — | 1995-08-22 |