Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10006565 | Fuel supply apparatus | Hiroaki Kito, Yoshinari Hiramatsu, Sanae Noro, Takeshi Aimiya | 2018-06-26 |
| 9490221 | Semiconductor device having multiple magnetic shield members | Tadashi Arai | 2016-11-08 |
| 8853841 | Lead frame which includes terminal portion having through groove covered by lid portion, semiconductor package, and manufacturing method of the same | — | 2014-10-07 |
| 8729680 | Semiconductor device | Narue Kobayashi, Tomoharu Fujii | 2014-05-20 |
| 8525355 | Semiconductor device, electronic apparatus and semiconductor device fabricating method | Hidenori Takayanagi, Hiroki Toyazaki, Toshio Gomyo | 2013-09-03 |
| 8402644 | Method of manufacturing an electronic parts packaging structure | Toshio Gomyo, Hidenori Takayanagi, Takaharu Yamano | 2013-03-26 |
| 8373997 | Semiconductor device | Narue Kobayashi, Tomoharu Fujii | 2013-02-12 |
| 8191568 | Fuel tank for motor vehicle | Norihiro Yamada, Hideyuki Tsuzuki, Tomohide Aoki | 2012-06-05 |
| 8053677 | Electronic apparatus and method of manufacturing the same, and wiring substrate and method of manufacturing the same | Tomoharu Fujii | 2011-11-08 |
| 7843059 | Electronic parts packaging structure | Toshio Gomyo, Hidenori Takayanagi, Takaharu Yamano | 2010-11-30 |
| 7816177 | Semiconductor device and method of manufacturing the same | Hidenori Takayanagi | 2010-10-19 |
| 7791206 | Semiconductor device and method of manufacturing the same | Hidenori Takayanagi | 2010-09-07 |
| 7788061 | Substrate and mask aligning apparatus | Hideaki Sakaguchi | 2010-08-31 |
| 7723838 | Package structure having semiconductor device embedded within wiring board | Hidenori Takayanagi | 2010-05-25 |
| 7279771 | Wiring board mounting a capacitor | Masahiro Sunohara, Kei Murayama, Mitsutoshi Higashi, Toshio Gomyo | 2007-10-09 |
| 6534846 | Lead frame for semiconductor device and semiconductor device using same | — | 2003-03-18 |
| 6429517 | Semiconductor device and fabrication method thereof | Mohan Kirloskar, Michio Horiuchi | 2002-08-06 |
| 6271478 | Multi-layer circuit board | Michio Horiuchi, Chiaki Takubo | 2001-08-07 |
| 6221749 | Semiconductor device and production thereof | Mohan Kirloskar, Michio Horiuchi | 2001-04-24 |
| 6194668 | Multi-layer circuit board | Michio Horiuchi, Eiji Yoda | 2001-02-27 |
| 6093476 | Wiring substrate having vias | Michio Horiuchi | 2000-07-25 |
| 5997999 | Sintered body for manufacturing ceramic substrate | Michio Horiuchi, Yoichi Harayama | 1999-12-07 |
| 5983950 | Hose structure and method of manufacturing the same | Tomohide Aoki, Masayuki Nakagawa, Katsumi Tanaka | 1999-11-16 |
| 5919546 | Porous ceramic impregnated wiring body | Michio Horiuchi | 1999-07-06 |
| 5744224 | Board for mounting semiconductor chip | Shigetsugu Muramatsu | 1998-04-28 |