Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322478 | Semiconductor device and semiconductor device array | Yoshihiro Ihara | 2022-05-03 |
| 10134680 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2018-11-20 |
| 9768122 | Electronic part embedded substrate and method of producing an electronic part embedded substrate | Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2017-09-19 |
| 9564364 | Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor package | — | 2017-02-07 |
| 9451702 | Chip embedded substrate and method of producing the same | Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2016-09-20 |
| 9048225 | Semiconductor device and method for manufacturing semiconductor device | Sumihiro Ichikawa | 2015-06-02 |
| 8793868 | Chip embedded substrate and method of producing the same | Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2014-08-05 |
| 8779573 | Semiconductor package having a silicon reinforcing member embedded in resin | Syota Miki | 2014-07-15 |
| 8564116 | Semiconductor device with reinforcement plate and method of forming same | — | 2013-10-22 |
| 8415796 | Semiconductor device having a multilayer structure | — | 2013-04-09 |
| 8402644 | Method of manufacturing an electronic parts packaging structure | Toshio Gomyo, Yukiharu Takeuchi, Hidenori Takayanagi | 2013-03-26 |
| 8349733 | Manufacturing method of substrate with through electrode | — | 2013-01-08 |
| 8299586 | Semiconductor device and method of manufacturing the same | Syota Miki | 2012-10-30 |
| 8253229 | Semiconductor package and stacked layer type semiconductor package | Tsuyoshi Kobayashi | 2012-08-28 |
| 8232639 | Semiconductor-device mounted board and method of manufacturing the same | Toshio Kobayashi, Takashi Kurihara | 2012-07-31 |
| 8211754 | Semiconductor device and manufacturing method thereof | — | 2012-07-03 |
| 8193617 | Semiconductor device and manufacturing method therefor | — | 2012-06-05 |
| 8183469 | Wiring board and method of manufacturing the same | Masahiro Sunohara, Kei Murayama | 2012-05-22 |
| 8129259 | Manufacturing method of preparing a substrate with forming and removing the check patterns in scribing regions before dicing to form semiconductor device | Yoichi Harayama | 2012-03-06 |
| 8102048 | Electronic device manufacturing method and electronic device | Tadashi Arai | 2012-01-24 |
| 7994431 | Substrate with built-in electronic component and method for manufacturing the same | Yoshihiro Machida | 2011-08-09 |
| 7989707 | Chip embedded substrate and method of producing the same | Hajime Iizuka, Hideaki Sakaguchi, Toshio Kobayashi, Tadashi Arai, Tsuyoshi Kobayashi +6 more | 2011-08-02 |
| 7985619 | Manufacturing method for semiconductor device embedded substrate | Toshio Kobayashi, Tadashi Arai | 2011-07-26 |
| 7981724 | Manufacturing method for semiconductor device embedded substrate | Toshio Kobayashi, Tadashi Arai | 2011-07-19 |
| 7964493 | Method of manufacturing semiconductor device | — | 2011-06-21 |