Issued Patents All Time
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7378732 | Semiconductor package | Takako Yoshihara, Masahiro Sunohara | 2008-05-27 |
| 7370411 | Wiring board manufacturing method | — | 2008-05-13 |
| 7365436 | Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same | — | 2008-04-29 |
| 7312536 | Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same | Tadashi Arai, Yoshihiro Machida | 2007-12-25 |
| 7288841 | Laminated semiconductor package | — | 2007-10-30 |
| 7250329 | Method of fabricating a built-in chip type substrate | Tadashi Arai | 2007-07-31 |
| 7105423 | Method of manufacturing semiconductor device | Nobuyuki Kurashima | 2006-09-12 |